Anti-polarization packaging adhesive film for double-sided battery and preparation method thereof

A technology for encapsulating adhesive films and double-sided batteries, applied in circuits, adhesives, photovoltaic power generation, etc., can solve problems such as failure to meet the PID requirements of double-sided battery components, slippage of adhesive films, and high polarity of additives. The compatibility of additives is poor, the production cost is low, and the effect of reducing air bubbles

Pending Publication Date: 2020-10-02
CHANGZHOU SVECK PHOTOVOLTAIC NEW MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, these additives have relatively high polarity, while POE has low polarity, so the compatibility is poor, and it is easy to precipitate when the temperature is low, resulting in slippage and bubbles during the use of the film.
However, the use of such additives in EVA film still cannot meet the PID requirements of double-sided battery modules.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] The adhesive film substrate provided in this embodiment is ethylene-vinyl acetate copolymer, the melt flow rate of the copolymer is 25g / 10min, the mass content of vinyl acetate is 28%, the adhesive film substrate ethylene-vinyl acetate The mass of ester copolymer is 100 parts, the addition amount of titanium dioxide semiconductor material is 7 parts by mass, tin sulfide is 3 parts by mass, and the content of other additives is as follows: dicumyl peroxide is 0.5 parts by mass; ethoxylated trimethylol 0.4 parts by mass of propane triacrylate; 0.04 parts by mass of hexadecyl 3,5-di-tert-butyl-4-hydroxy-benzoate; tetrakis[β-(3,5-di-tert-butyl-4 -Hydroxyphenyl)propionic acid]pentaerythritol ester is 0.05 parts by mass; vinyltriethoxysilane is 0.6 parts by mass.

[0028] After pre-mixing the above materials, a single-screw extruder is used to extrude, cast, or calender to form a film. The thickness of the film is 50-800 μm, and the thickness of the film in this embodiment is...

Embodiment 2

[0030] The adhesive film substrate provided in this embodiment is an ethylene-vinyl acetate copolymer, the melt flow rate of the copolymer is 20 g / 10 min, and the vinyl acetate content is 28%. The quality of the film substrate ethylene-vinyl acetate copolymer is 100 parts, the addition amount of aluminum-doped zinc oxide semiconductor material is 13 parts by mass, and the content of other additives is as follows: bis-tert-butylperoxide dicumylbenzene is 0.6 parts by mass; propoxylated trimethylolpropane triacrylate is 0.3 parts by mass; bis(2,2,6,6-tetramethylpiperidinyl) sebacate is 0.03 parts by mass; β-(3,5 - 0.07 parts by mass of n-octadecyl di-tert-butyl-4-hydroxyphenyl) propionate; 0.9 parts by mass of vinyltrimethoxysilane.

[0031] After pre-mixing the above materials, a single-screw extruder is used to extrude, cast, or calender to form a film. The thickness of the film is 50-800 μm, and the thickness of the film in this embodiment is 100 μm.

Embodiment 3

[0033] The adhesive film substrate provided in this embodiment is an ethylene-α-olefin copolymer, and the melt flow rate of the copolymer is 15 g / 10 min. 10 parts by mass of titanium dioxide semiconductor material was added. The contents of other additives are as follows: 0.4 parts by mass of 2,5-dimethyl-2,5-bis(tert-butylperoxy)hexane; 0.3 parts by mass of pentaerythritol triacrylate; three (1,2,2 , 6,6-pentamethyl-4-piperidinyl)phosphite is 0.05 parts by mass; N,N'-bis-(3-(3,5-di-tert-butyl-4-hydroxyphenyl)propane Acyl)hexamethylenediamine is 0.06 parts by mass; vinyltris(b-methoxyethoxy)silane is 0.4 parts by mass.

[0034] After pre-mixing the above materials, a single-screw extruder is used to extrude, cast, or calender to form a film. The thickness of the film is 50-800 μm, and the thickness of the film in this embodiment is 800 μm.

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Abstract

The invention relates to the technical field of packaging adhesive films, in particular to a packaging adhesive film capable of improving PID resistance of a double-sided assembly and a preparation method of the packaging adhesive film. The packaging adhesive film comprises the following components in parts by mass: 100 parts of matrix resin, 0.1-20 parts of an N-type semiconductor, 0.01-2 parts of a peroxide cross-linking agent, 0.1-10 parts of an assistant cross-linking agent, 0.01-5 parts of a light stabilizer, 0.05-5 parts of an antioxidant, and 0.1-5 parts of a coupling agent. According to the anti-polarization packaging adhesive film for the double-sided battery, the N-type semiconductor material is added into the adhesive film, so that the adhesive film has certain electrons, polarization positive charges generated by the double-sided battery in the PID process can be neutralized, PID is avoided, and the anti-PID performance of the adhesive film is remarkably improved; the preparation method of the anti-polarization packaging adhesive film for the double-sided battery is simple in preparation process and low in production cost.

Description

technical field [0001] The invention relates to the technical field of encapsulating adhesive films, in particular to an encapsulating adhesive film capable of improving the anti-PID performance of double-sided components and a preparation method thereof. Background technique [0002] According to the 2020 International Photovoltaic Technology Route Forecast (ITRPV), the market share of bifacial cells will exceed 50% by 2026. Due to the special battery structure of the double-sided battery, a layer of positive charges will be generated on the surface of the battery sheet under the conditions of negative bias voltage, temperature of 85°C, and humidity of 85%, which is called polarized charge, which destroys the integrity of the battery sheet. The passivation effect causes the recombination of the minority carrier and the majority carrier, resulting in the loss of current and opening voltage, resulting in power loss (PID attenuation). [0003] The PID attenuation caused by th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/10C09J7/30C09J123/08C09J11/04C09J11/06H01L31/048
CPCC08K2003/2241C08K2003/2296C08K2003/3009C08K2201/005C09J11/04C09J11/06C09J123/0815C09J123/0853C09J2203/33C09J7/10C09J7/30H01L31/0481C08K13/02C08K3/22C08K3/30C08K3/34Y02E10/50
Inventor 季志超吕松黄宝玉张刚乔刚
Owner CHANGZHOU SVECK PHOTOVOLTAIC NEW MATERIAL
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