Multilayer coextruded anti-polarization composite adhesive film and preparation method thereof
A multi-layer co-extrusion and anti-polarization technology, applied in the direction of non-polymer organic compound adhesives, adhesives, adhesive additives, etc., can solve the problem of reducing the light transmittance and volume resistivity of the adhesive film, and reducing the power generation efficiency of the cell , reduce power generation efficiency of components and other issues, achieve the effects of reducing light transmittance and volume resistivity, improving anti-PID performance, and reducing power generation efficiency
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Embodiment 1
[0075] (1) Mix 100 parts of POE resin (melt flow rate is 18g / 10min, light transmittance > 90%, volume resistivity ≥ 1.0×10 15 , melting temperature is 64°C), 0.9 parts of tert-amyl peroxide 2-ethylhexylate, 0.8 parts of tripropenyl isocyanurate, 0.4 parts of vinyltriacetoxysilane, 0.15 parts of dihydroxy-tetra- n-octylhydroxybenzophenone, 0.15 parts of 2-(2-hydroxy-3,5-di-tert-butylphenyl)-5-chlorinated benzotriazole, 0.2 parts of β-(3,5-di tert-butyl-4-hydroxyphenyl) n-octadecyl propionate was mixed evenly, and poured into the silo of the first single-screw extruder for use; (2) 100 parts of EAA resin, 0.9 parts of Oxidized tert-amyl 2-ethylhexylate, 0.8 parts of tripropenyl isocyanurate, 0.4 parts of vinyltriacetoxysilane, 0.15 parts of dihydroxy-tetra-n-octylhydroxybenzophenone, 0.15 parts Parts of 2-(2-hydroxy-3,5-di-tert-butylphenyl)-5-chlorinated benzotriazole, 0.2 parts of β-(3,5-di-tert-butyl-4-hydroxyphenyl)propane Mix n-octadecanyl acid ester evenly, pour it into t...
Embodiment 2
[0078] (1) Mix 100 parts of POE resin (melt flow rate is 14g / 10min, light transmittance > 90%, volume resistivity ≥ 1.0×10 15 , melting temperature is 58°C), 0.8 parts of tert-butyl peroxy-2-ethylhexyl carbonate, 0.3 parts of ethoxylated pentaerythritol tetraacrylate, 0.6 parts of tripropenyl isocyanurate, 0.5 parts of γ-methacrylic acid Acyloxypropyltrimethoxysilane, 0.1 part of bis(2,2,6,6-tetramethylpiperidinyl) sebacate, 0.1 part of 2,2-dihydroxy-4-methoxydiphenyl Methanone, 0.1 part of triethylene glycol bis[β-(3-tert-butyl-4-hydroxy-5-methylphenyl)propionate] mixed evenly, poured into the first single-screw extruder In the silo, ready for use; (2) 100 parts of EMA resin, 0.8 part of tert-butyl peroxy-2-ethylhexyl carbonate, 0.3 part of ethoxylated pentaerythritol tetraacrylate, 0.6 part of tripropenyl isocyanurate , 0.5 parts of γ-methacryloxypropyltrimethoxysilane, 0.1 parts of bis(2,2,6,6-tetramethylpiperidinyl) sebacate, 0.1 parts of 2,2-dihydroxy - 4-Methoxybenzoph...
Embodiment 3
[0081] (1) Mix 100 parts of POE resin (melt flow rate is 14g / 10min, light transmittance > 90%, volume resistivity ≥ 1.0×10 15 , melting temperature is 58°C), 0.6 parts of tert-butyl peroxy-2-ethylhexyl carbonate, 0.2 parts of ethoxylated pentaerythritol tetraacrylate, 0.6 parts of tripropenyl isocyanurate, 0.3 parts of γ-methacrylic acid Acyloxypropyltrimethoxysilane, 0.2 parts of bis(2,2,6,6-tetramethylpiperidinyl) sebacate, 0.2 parts of 2-hydroxy-4-n-octyloxybenzophenone , 0.05 parts of triethylene glycol bis[β-(3-tert-butyl-4-hydroxy-5-methylphenyl) propionate] mixed evenly, poured into the first single-screw extruder silo (2) Mix 100 parts of PTW resin, 0.6 parts of tert-butyl peroxy-2-ethylhexyl carbonate, 0.2 parts of ethoxylated pentaerythritol tetraacrylate, 0.6 parts of tripropenyl isocyanurate, 0.3 parts Parts of γ-methacryloxypropyltrimethoxysilane, 0.2 parts of bis(2,2,6,6-tetramethylpiperidinyl) sebacate, 0.2 parts of 2-hydroxy-4-n-octyl Oxybenzophenone, 0.05 pa...
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