Packaging substrate, LED device, LED module and manufacturing method of LED module

Abstract

The invention discloses a packaging substrate, an LED device, an LED module and a manufacturing method of the LED module. The packaging substrate comprises a first electrode, a second electrode and aninsulation isolation region; the insulation isolation region is arranged between the first electrode and the second electrode; the first electrode is provided with a first convex part and a second convex part; the second electrode is provided with a third convex part; the first convex part of the first electrode, the second convex part of the first electrode and the third convex part of the second electrode are arranged in a staggered mode; a first side wall of the insulation isolation region is provided with a first concave part and a second concave part; a second side wall is provided witha third concave part; the first concave part is matched with the first convex part; the second concave part is matched with the second convex part; and the third concave part is matched with the thirdconvex part, so that the combined surfaces between the insulation isolation region and the first and second electrodes are of concave-convex interdigital structures. According to the packaging substrate, the LED device, the LED module and the manufacturing method of the LED module, the first electrode and the second electrode can be prevented from falling off, the routing distance is shortened, and the reliability of leads is improved.

Description

technical field [0001] The invention relates to the technical field of LEDs, in particular to a package substrate, an LED device, an LED module and a manufacturing method thereof. Background technique [0002] Such as figure 1 Shown is a schematic structural diagram of an existing packaging substrate. The existing packaging substrate 100 includes a first electrode 101, a second electrode 102 and an insulating isolation region 103, wherein the first electrode 101 and the second electrode 102 are separated from each other and parallel to each other, and the area of ​​the first electrode 101 is smaller than that of the second electrode 102 area; the insulating isolation region 103 is disposed between the first electrode 101 and the second electrode 102 . When using the packaging substrate to package the LED chip 201, the LED chip 201 and the Zener diode 202 are usually fixed on the second electrode 102, and the anode of the LED chip 201 is connected to the first electrode 101...

AI Technical Summary

Problems solved by technology

[0003] However, since the bonding surface between the first electrode 101 and the second electrode 102 and the insulating isolation region 103 in the existing packaging substrate is planar, the connection between the first electrode 101 and the second electrode 102 and the insulating isolation region 103 The bonding surface is easy to fall off; and the insulating isolation region 103 is in the shape of a strip. In order to increase the strength of the insulating isolation region 103, the existing insulating isolation region 103 has a larger width, which will lead to a large span of the lead wire 203, thereby reducing the LED packaging device. reliability

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