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LED lamp processing device

A technology of processing equipment and LED lamps, which is applied in the direction of coating and liquid coating on the surface, etc., can solve the problems of too tight arrangement of chips, blockage of glue guns, increase of chip spacing, etc., so as to facilitate production and avoid over sticking Thick effect

Inactive Publication Date: 2019-02-19
HANGZHOU XIAOCHENG IND DESIGN CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the arrangement of the chips on the chip film is too tight to be directly applied to the die-bonding process, so the chip spacing on the chip film is increased through the crystal expansion process; and the chip cannot be directly mounted on the bracket, and it needs to be coated on the bracket first. Glue, so put glue on the bracket through the dispensing process; currently, most of the glue dispensers are used to dispense glue on the brackets, but the glue dispensers on the market often lose water in the glue and become viscous, eventually clogging the glue gun problem

Method used

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  • LED lamp processing device
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Embodiment Construction

[0028] In order to enable those skilled in the art to better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention.

[0029] like Figure 1-12 As shown, a kind of LED lamp processing equipment, LED lamp processing procedures are complex, including crystal expansion process, cleaning process, warming process, dispensing process, solid crystal process, baking process, wire bonding process, assembly process and testing process ; Emphasis of the present invention is crystal expansion process and dispensing process, comprises base 1, the crystal expansion mechanism that is located on described base 1 and the dispensing mechanism that is located on described base 1; Wherein crystal expansion mechanism is used for pulling For stretching the chip film, because when the chip film just came out, the c...

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Abstract

The invention discloses an LED lamp processing device. The device comprises a base, a crystal expanding mechanism and a glue dispensing mechanism; the crystal expanding mechanism comprises a placementplatform, a crystal expanding part, an annular cutting part and a film pressing part, the glue dispensing mechanism comprises a glue gun frame, a glue gun and a feeding device, a fixed ring is arranged on the lower surface of the film pressing part, a first channel matched with the crystal expanding part is arranged on the annular cutting part, a second channel allowing the crystal expanding partto pass through is arranged on the film pressing part, a third channel the same with the crystal expanding part in size and shape is arranged on the placement platform, a glue dispensing head is detachably connected to the glue gun, a telescopic assembly is arranged in the glue dispensing head, and the glue gun is externally connected with a liquid inlet assembly. Through the liquid inlet assembly, glue in the glue gun can be kept at the proper concentration all the time, and the problem that due to solidification of glue in the glue gun, blockage is caused is solved.

Description

technical field [0001] The invention belongs to the technical field of LED lamps, and in particular relates to LED lamp processing equipment. Background technique [0002] LED is the abbreviation of light-emitting diode, which is a solid-state semiconductor device that can convert electrical energy into visible light; the heart of the LED is a semiconductor chip, which is fixed on the bracket through the crystal-bonding process, and then connected to the power supply to realize the LED's light emission . [0003] However, the arrangement of the chips on the chip film is too tight to be directly applied to the die-bonding process, so the chip spacing on the chip film is increased through the crystal expansion process; and the chip cannot be directly mounted on the bracket, and it needs to be coated on the bracket first. Glue, so put glue on the bracket through the dispensing process; currently, most of the glue dispensers are used to dispense glue on the brackets, but the gl...

Claims

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Application Information

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IPC IPC(8): B05C5/02B05C11/10B05C13/02
CPCB05C5/0212B05C5/027B05C11/1002B05C11/1042B05C13/02
Inventor 李颖
Owner HANGZHOU XIAOCHENG IND DESIGN CO LTD
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