A multi-station automatic suction processing production line for electronic chips
An electronic chip and multi-station technology, applied in the direction of transportation and packaging, conveyor objects, etc., can solve the problems of low transmission efficiency, deviation of IC chip picking position, and inability to correct the polarity of IC chips, so as to increase the working accuracy, The effect of high transmission efficiency
Active Publication Date: 2020-10-13
浙江台州绿源气体有限公司
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Problems solved by technology
[0003] In order to solve the above problems, the present invention provides a multi-station automatic suction and processing production line for electronic chips, which can solve the problems of low transmission efficiency of IC chips, inability to automatically correct the polarity of IC chips, etc. There are problems such as deviation in the pick-up position of the IC chip; it can realize the pick-up and transfer of the IC chip and the function of automatic polarity correction, with high transmission efficiency, automatic correction of the polarity of the IC chip, and the pick-up position of the IC chip Advantages such as no bias
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[0019] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further described below in conjunction with specific illustrations. It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other.
[0020] Such as Figure 1 to Figure 4 As shown, an electronic chip multi-station automatic suction processing production line includes a support base 1, a conveyor belt 2 and a suction device 3, a conveyor belt 2 is installed on the top left end of the support base 1, and the suction device 3 is installed on the support base 1 On the top of the outer end, the conveyor belt 2 can transfer the IC chips to a suitable suction position, so that the suction device 3 can suck up the IC chips.
[0021]The suction device 3 includes a suction pillar 31, a suction top plate 32, a screw motor 33...
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The invention relates to an electronic chip multi-station automatic suction processing production line. The production line comprises a supporting bottom plate, a conveyor belt and a suction device, wherein the conveyor belt is installed on the top of the left end of the supporting bottom plate, and the suction device is installed on the top of the outer end of the supporting bottom plate; the suction device comprises a suction supporting column, a suction top plate, a lead screw motor, a lead screw, a lead screw connecting plate, a moving block, a transposition mechanism and a suction mechanism; the transposition mechanism comprises a sliding column, a transposition top plate, a transposition motor, a transposition disc, a transposition sliding groove, a transposition sliding column, a clamping position telescopic rod, a clamping position spring and a clamping position clamping block. According to the production line, the problems that the conveying efficiency of IC chips is low whenexisting IC chips are packaged, the polarity of the IC chips cannot be corrected automatically, and the suction position of the IC chips is deviated are solved.
Description
technical field [0001] The invention relates to the technical field of electronic product processing, in particular to a multi-station automatic suction processing production line for electronic chips. Background technique [0002] An IC chip is an IC chip made by placing an integrated circuit formed by a large number of microelectronic components on a plastic base; the IC chip needs to be packaged after processing and testing, and part of the IC chip is packed in a roll In the tape, most of the IC chips are installed in the tray, especially the square IC chip. This IC chip has a square structure and has pins installed on the four sides. It is necessary to adjust the polarity of the IC chip. Now some small IC chip processing factories generally use semi-automatic packaging for square IC chips. After the IC chip is processed, it is sent to the designated position and passed through the suction nozzle. The IC chips are transferred to the tray. The problems of this working met...
Claims
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IPC IPC(8): B65G47/91
CPCB65G47/914
Inventor 彭婷
Owner 浙江台州绿源气体有限公司