Covers and displays
A cover plate and display substrate technology, applied in semiconductor devices, electrical components, circuits, etc., can solve problems such as reducing the resistance of the top electrode
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Problems solved by technology
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Embodiment 1
[0022] Such as figure 1 As shown, the existing method for reducing the resistance of the top electrode 24 is to set the auxiliary electrode 16 on the cover plate 1. The material of the auxiliary electrode 16 is also transparent such as indium tin oxide (ITO), indium zinc oxide (IZO) or thinned metal. Material. At the position of the pixel defining layer 22 of the cover plate 1 corresponding to the display substrate 2 (here, the non-display area), the auxiliary electrode 16 is raised by the bump 15, just in line with the top electrode 24 raised by the pixel defining layer 22. The raised parts are opposite.
[0023] However, during the packaging and pressing process of the display substrate 2 and the cover plate 1, since the top electrode 24 and the auxiliary electrode 16 are formed of hard and relatively brittle materials, if the pressing force is too large, it is easy to cause the auxiliary electrode 16 to be brittle. , or even disconnected, which fails to achieve the purpos...
Embodiment approach
[0030] Optionally, the conductive material 31 includes conductive photoresist. In this embodiment, the conductive support structure 3 can be manufactured by first forming the shape of the organic insulating material 32 , then spin-coating the conductive photoresist, and then etching and removing the conductive photoresist other than the organic insulating material 32 .
[0031] Optionally, the conductive photoresist includes a photoresist body and conductive metal particles doped in the photoresist body. For example, conductive metal particles (preferably 10nm-100nm in diameter) are mixed into photosensitizers such as thermoplastic resins, aromatic alcohol derivatives or benzoin ether derivatives. Of course, other commonly used additives can also be mixed in the photosensitizer.
[0032] In order to reduce the resistance of the conductive material 31 itself, the resistivity of the conductive material 31 should preferably be lower than 1×10 -7 Ω*m.
[0033] Optionally, in th...
Embodiment 2
[0047] This embodiment provides a display device that participates in image 3 , including a display substrate 2 and a cover plate 1, the display substrate 2 includes a bare top electrode 24, the cover plate 1 is the cover plate 1 provided according to Embodiment 1 of the present invention, the top electrode 24 and the conductive material 31 in the conductive support structure 3 touch.
[0048] That is to say, the cover plate 1 provided in Example 1 is mated with the display substrate 2, and the conductive material 31 of the conductive support structure 3 in the cover plate 1 is in contact with the top electrode 24 to realize electrical connection, thereby realizing the connection between the top electrode 24 and the auxiliary electrode 16. electrical connection. At least two positions of the same auxiliary electrode 16 are electrically connected to the top electrode 24 , so that the parallel connection of the two can be realized, thereby reducing the overall resistance of th...
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