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Micro SD card special-shaped frame cutting process

A cutting process and special-shaped technology, which is applied in the direction of manufacturing tools, metal processing equipment, welding equipment, etc., can solve the problems of large fluctuations in product yield, product pollution of the environment, and low grinding precision, so as to reduce the packaging process, reduce costs, The effect of improving product accuracy

Active Publication Date: 2019-03-01
POWERTECH TECH SUZHOU
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  • Claims
  • Application Information

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Problems solved by technology

[0005] However, in the above process technology, the grinding machine relies on the jig to grind the product, and abrasives are needed in the process, which is easy to cause product pollution and is not friendly to the environment; usually only three products can be polished at a time, UPH (Unit Per Hour per hour) Hourly output) is lower and the cost is higher; purely mechanical positioning, lower grinding accuracy, and large fluctuations in product yield

Method used

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  • Micro SD card special-shaped frame cutting process

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Embodiment

[0050] A kind of Micro SD card special-shaped frame cutting process, it comprises the following steps:

[0051] S100, place the entire material on the cutting platform, the cutting platform is a vacuum adsorption platform, and the vacuum value is less than -60kPa, which can ensure that the material cannot move during the cutting process, thereby improving the processing accuracy of the product.

[0052] S200, use a vision system to locate the entire strip of material. In this embodiment, the vision system is a BIV system.

[0053] S300, see figure 1 , use laser to cut the special-shaped parts 1 of all products on the whole material. In this embodiment, a single product includes five special-shaped parts 1. Compared with the traditional cutting technology, it is not necessary to cut the whole material beforehand. Into a single chip, can greatly improve UPH, reduce the packaging process, and reduce costs;

[0054] The laser power is 50~54W, below this value the material cannot...

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Abstract

The invention discloses a Micro SD card special-shaped frame cutting process, and relates to the technical field of Micro SD card packaging. The Micro SD card special-shaped frame cutting process aimsto solve the problems that a traditional cutting process is used for cutting a special-shaped frame, the efficiency is low, the precision is low, and the environment is polluted. According to the technical scheme, the method comprises the following steps: S100, a whole material is placed on a cutting platform; S200, the whole material is positioned; S300, a special-shaped part is cut by using laser; S400, the size of the cutting position is detected by using a visual system after the cutting is completed; S500, the whole material is cut into a plurality of single products by using a cutter; and S600, a plurality of single products are washed. According to the Micro SD card special-shaped frame cutting process, the effect of improving the cutting efficiency and precision of the special-shaped frame of a Micro SD card can be achieved.

Description

technical field [0001] The invention relates to the technical field of Micro SD card packaging, and more specifically, it relates to a cutting process for a Micro SD card shaped frame. Background technique [0002] Micro SD card is one of the mainstream SD card packaging types at present. It has the advantages of small size (the appearance size of the product is 11mm*15mm*1mm), high reliability and good electrical performance. [0003] Generally, product frames that are not perpendicular to each other or with rounded corners are called irregular frames (irregular frames). The cutting of the irregular frame of MicroSD cards has always been a difficult point in the industry. [0004] At present, the domestic technology for cutting special-shaped frames usually adopts the method of first cutting the product into the shape of tofu block (square shape), and then grinding the single product in the shape of tofu block into the final product by using metal fixtures on the grinding e...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/38B23K26/00
CPCB23K26/0093B23K26/38
Inventor 杨遥阮红燕顾玉萍徐辉叶花勇袁晓颖张振燕
Owner POWERTECH TECH SUZHOU
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