A kind of high-efficiency heat dissipation packaging metal shell for chips

Abstract

The invention discloses an efficient heat dissipation packaging metal shell of a chip, and in the technical field of chip packaging metal shells. The efficient heat dissipation packaging metal shell of the chip comprises a metal shell, wherein a snake-shaped water cooling pipe is arranged at the top end of the metal shell; the water inlet end of the snake-shaped water cooling pipe penetrates through the inner wall of the right side of the metal shell and is connected with a water cooling side pipe; the water outlet end of the snake-shaped water cooling pipe penetrates through the inner wall ofthe left side of the metal shell and is connected with a water cooling side pipe; a miniature circulating pump is arranged between the water cooling side pipes on the right side through a connectingpipeline; a reaction cavity is defined by a graphite plate in the end wall at the top of the metal shell, and a water supplementing pipeline is arranged on the right side of the reaction cavity; a water supplementing water bag is connected to the right side of the water supplementing pipeline; cooling fins are arranged at the top of the metal shell; heat conduction silicone grease is arranged on the inner wall of the inner top end of the metal shell; the device adopts physical heat dissipation and chemical heat absorption in a combined mode, so that heat dissipation on the heat generated by the chip in working is more efficient, and the service life of the chip is prolonged.

Description

technical field [0001] The invention relates to the technical field of chip packaging metal shells, in particular to an efficient heat dissipation packaging metal shell for chips. Background technique [0002] With the development needs of various electronic industries, packaging shells are widely used in military and civilian fields such as aerospace, aviation, navigation, field operations, radar, communications, weapons, etc., especially metal packaging shells, metal shells carry circuits to protect them from mechanical damage, providing Physical protection, the packaging of products in the field of chip microelectronics is becoming more and more widely used, and the demand is increasing. However, the current heat dissipation structure of the metal shell of the chip package is provided with heat dissipation fins on the outside, which has low heat dissipation efficiency and poor effect. , affecting the service life of the chip. To this end, we propose a highly efficient he...

AI Technical Summary

Problems solved by technology

[0002] With the development needs of various electronic industries, packaging shells are widely used in military and civilian fields such as aerospace, aviation, navigation, field operations, radar, communications, weapons, etc., especially metal packaging shells, metal shells carry circuits to protect them from mechanical damage, providing Physical protection, the packaging of products in the field of chip microelectronics is becoming more and more widely used, and the demand is increasing. However, the current heat dissipation structure of the metal shell of the chip package is provided with heat dissipation fins on the outside, which has low heat dissipation efficiency and poor effect. , affecting the service life of the chip

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