Heat dissipation plate and manufacturing method thereof

Abstract

The invention discloses a heat dissipation plate matched with an electronic product for heat dissipation. The heat dissipation plate comprises a first plate body, a second plate body, fixed glue layers connected to two ends of the first plate body and two ends of the second plate body, at least one support pillar and cooling liquid, wherein the first plate body, the second plate body and the fixedglue layers are encircled together to form a sealed cavity; the cooling liquid is accommodated in the cavity; the at least one support pillar is positioned inside the cavity; the support pillar is vertical to the first plate body and the second plate body; the cavity is connected with the at least one support pillar; the evaporation heat of the cooling liquid is 112 kj / kg to 119 kj / kg; the specific heat of the cooling liquid is 1183 J / kg.K to 1220 J / kg.K; the second plate body is made of copper, and is used for connecting with a heat source of the electronic product; and the surfaces, facingthe cavity, of the first plate body and the second plate body are surfaces without capillary structure.

Description

technical field [0001] The invention relates to a heat dissipation plate, in particular to a heat dissipation plate and a manufacturing method thereof. Background technique [0002] Today's electronic products, such as mobile phones, tablets, smart bracelets, etc., are developing rapidly. Electronic products have more functions and stronger performance, so as to better meet the needs of consumers and improve the effect of consumer experience. [0003] The stronger performance of these electronic products needs to be realized by increasing the data processing speed, so that the electronic products need to be configured with high-frequency, multi-core CPUs and highly integrated circuits. However, the higher the frequency of the CPU, the higher the number of cores, and the higher the integration of the circuit board, the more heat is generated, and the electronic products need to be equipped with better heat dissipation methods to ensure normal operation. [0004] At present, ...

AI Technical Summary

Problems solved by technology

However, the complex internal structure of heat pipes usually increases the manufacturing cost of electronic products

On the other hand, electronic products equipped with heat pipes need to reserve a certain space to accommodate the heat pipes, which is not conducive to the thin and light design of electronic products

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