Heat dissipation plate and manufacturing method thereof
A manufacturing method and technology for a heat dissipation plate, which are applied in cooling/ventilation/heating transformation, electrical equipment structural parts, instruments, etc., can solve the problems of complex heat pipe structure, increased manufacturing cost of electronic products, and unfavorable thin design of electronic products.
Active Publication Date: 2019-03-01
AVARY HLDG (SHENZHEN) CO LTD +1
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Abstract
The invention discloses a heat dissipation plate matched with an electronic product for heat dissipation. The heat dissipation plate comprises a first plate body, a second plate body, fixed glue layers connected to two ends of the first plate body and two ends of the second plate body, at least one support pillar and cooling liquid, wherein the first plate body, the second plate body and the fixedglue layers are encircled together to form a sealed cavity; the cooling liquid is accommodated in the cavity; the at least one support pillar is positioned inside the cavity; the support pillar is vertical to the first plate body and the second plate body; the cavity is connected with the at least one support pillar; the evaporation heat of the cooling liquid is 112 kj/kg to 119 kj/kg; the specific heat of the cooling liquid is 1183 J/kg.K to 1220 J/kg.K; the second plate body is made of copper, and is used for connecting with a heat source of the electronic product; and the surfaces, facingthe cavity, of the first plate body and the second plate body are surfaces without capillary structure.
Application Domain
Digital data processing detailsSemiconductor/solid-state device details +1
Technology Topic
EngineeringCooling fluid +3
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PUM
Property | Measurement | Unit |
Surface tension | 13.6 | MN/M |
Tension | 13.6 | mN/m |
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