Heat dissipation plate and manufacturing method thereof

A manufacturing method and technology for a heat dissipation plate, which are applied in cooling/ventilation/heating transformation, electrical equipment structural parts, instruments, etc., can solve the problems of complex heat pipe structure, increased manufacturing cost of electronic products, and unfavorable thin design of electronic products.

Active Publication Date: 2019-03-01

AVARY HLDG (SHENZHEN) CO LTD +1

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AI-Extracted Technical Summary

Problems solved by technology

However, the complex internal structure of heat pipes usually increases the manufacturing cost of electronic products

On the other hand, electronic products equ...

Method used

[0060] In addition, since the heat dissipation plate directly passes through the first plate body 10, the circulation of the cooling ...

Abstract

The invention discloses a heat dissipation plate matched with an electronic product for heat dissipation. The heat dissipation plate comprises a first plate body, a second plate body, fixed glue layers connected to two ends of the first plate body and two ends of the second plate body, at least one support pillar and cooling liquid, wherein the first plate body, the second plate body and the fixedglue layers are encircled together to form a sealed cavity; the cooling liquid is accommodated in the cavity; the at least one support pillar is positioned inside the cavity; the support pillar is vertical to the first plate body and the second plate body; the cavity is connected with the at least one support pillar; the evaporation heat of the cooling liquid is 112 kj/kg to 119 kj/kg; the specific heat of the cooling liquid is 1183 J/kg.K to 1220 J/kg.K; the second plate body is made of copper, and is used for connecting with a heat source of the electronic product; and the surfaces, facingthe cavity, of the first plate body and the second plate body are surfaces without capillary structure.

Application Domain

Digital data processing detailsSemiconductor/solid-state device details +1

Technology Topic

EngineeringCooling fluid +3

Image

Examples

Experimental program(3)

Example Embodiment

[0037] Example 1

[0038] like figure 1 As shown, in the embodiment of the present invention, the heat dissipation plate 100 is used for dissipating heat in an electronic product.

[0039] The heat dissipation plate 100 includes a first plate body 10 , a second plate body 20 disposed opposite to the first plate body 10 , a fixing adhesive layer 30 connecting the first plate body 10 and the second plate body 20 , a support column 40 , and the cooling liquid 50 accommodated between the first plate body 10 and the first plate body 10 .

[0040] The heat dissipation plate 100 has a first end A and a second end B. The first section A is an evaporation section, and the second end B is a condensation section.

[0041] Understandably, the first section A is the condensation end, and the second end B is the evaporation end. The first end A and the second end B are located at two ends of the first plate body 10 respectively.

[0042] In the heat dissipation plate 100 according to the first embodiment of the present invention, the first plate body 10 and the second plate body 20 are arranged at intervals. The first plate body 10 and the second plate body 20 are made of the same material and are both composed of copper.

[0043] The fixing adhesive layer 30 is disposed on both ends of the first board body 10 and the second board body 20 for connecting the first board body 10 and the second board body 20 .

[0044] The first plate body 10 , the second plate body 20 and the fixing adhesive layer 30 together form a sealed cavity 120 .

[0045] The cooling liquid 50 is accommodated in the cavity 120 . The surfaces of the first plate body 10 and the second plate body 20 facing the cavity are surfaces without capillary structures.

[0046] The support columns 40 are located in the cavity 120 , and the number of the support columns 40 is plural. The material of the support column 40 is copper.

[0047] Each of the support columns 40 extends from the first board body 10 toward the second board body 20 and is connected to the second board body 20 . The support columns 40 are respectively perpendicular to the first plate body 10 and the second plate body 20 .

[0048] The cavity 120 communicates between each of the support columns 40 , that is, the cavity 120 is not isolated by the support columns 40 .

[0049] The cooling liquid 50 is accommodated in the cavity 120 . The heat of evaporation of the cooling liquid 50 is 112 kj/kg to 119 kj/kg. The specific heat of the cooling liquid 50 is 1183 J/kg.K to 1220 J/kg.K.

[0050] The heat conduction temperature control rate of the cooling liquid 50 is 0.069W//M.K to 0.068W//M.K.

[0051] The surface tension of the cooling liquid 50 is 13.6 MN/M.

Example

[0052] Second Embodiment

[0053] like figure 2 As shown, the heat dissipation plate 100a of the second embodiment of the present invention is similar to the heat dissipation plate 100 of the first embodiment, and the difference is that the first plate body 10a is an electronic product support structure.

Example

[0054] Third Embodiment

[0055] like image 3As shown, the heat dissipation plate 100b of the third embodiment of the present invention is similar to the heat dissipation plate 100 of the first embodiment, and the difference lies in that: the first plate body 10b is a supporting structure for electronic products, and the support columns 40b are Electronic product support structure. The support column 40b and the first plate body 10b are separately formed or integrally formed. The support column 40b extends vertically from the first plate body 10b toward the first plate body 10b and is connected to the second plate body 20 .

[0056] like Figure 4 As shown, when the heat dissipation plate of the present invention works, the first end A of the heat dissipation plate is in contact with a heat source 200 . The cold cooling liquid 50 is evaporated at the first end A, and the evaporated gas of the cooling liquid 50 flows back to the second end B along the inner wall of the first plate body 10 after being in the cavity 120 cool down. The cooling liquid 50 flows back to the first end after the second end B is cooled to a liquid state.

[0057] In this way, the cooling liquid 50 continuously circulates in the cavity 120 , and the heat generated by the heat source 200 is transferred to the first plate body 10 through the cooling liquid, and is radiated to the outside through the first plate body 10 .

[0058] Compared with the existing heat pipe heat dissipation, the heat generated by the heat source 200 in the present invention is directly transferred to the electronic product support structure through the cooling liquid 50, without the need to transfer the heat of the heat source to the heat pipe and then transfer it to the electronic product through the heat pipe. on the support structure of electronic products.

[0059] In this way, the heat dissipation efficiency of the heat dissipation plate is high, and at the same time, the volume and thickness of the heat dissipation plate can be reduced, which is more conducive to the light and thin design of the electronic product after being matched with the electronic product.

[0060] In addition, since the cooling liquid can be circulated directly through the first plate body 10 without the need for a capillary structure, the manufacturing cost of the cooling plate is reduced.

[0061] like Figure 5-9 Shown is the manufacturing method of the heat dissipation plate of the present invention, comprising the following steps:

[0062] The first step: as Figure 5 As shown, a first plate body 10 and a support column 40 formed on the first plate body 10 are provided.

[0063] The first board body 10 is composed of copper or is a support structure for electronic products. The support column 40 is made of copper or is a support structure for electronic products.

[0064] The support column 40 and the first plate body 10 are formed separately, or the support column 40 and the first plate body 10 are integrally formed.

[0065] The second step: as Image 6 As shown, fixing glue 30 is applied on both ends of the first plate body 10 .

[0066] The third step: as Figure 7 As shown, a cooling bag 50 a packed with a cooling liquid 50 is provided on the first plate body 10 .

[0067] Wherein, the cooling bag 50a is soluble in vacuum, and the evaporation heat of the cooling liquid 50 is 112kj/kg to 119kj/kg. The specific heat of the cooling liquid 50 is 1183 J/kg.K to 1220 J/kg.K. The heat conduction temperature control rate of the cooling liquid 50 is 0.069W//M.K to 0.068W//M.K. The surface tension of the cooling liquid 50 is 13.6 MN/M.

[0068] Step 4: As Figure 8 As shown, a second plate body 20 is provided and pressed onto the first plate body 10, so that the cooling bag 50a is sealed to the first plate body 10, the second plate body 20 and the fixing glue 30 into the formed cavity 120 , and the cavity 120 is evacuated.

[0069] Step 5: as Figure 9 As shown, wait until the cooling bag 50a is dissolved, the cooling liquid 50 is accommodated in the cavity 120, and the heat dissipation plate is manufactured.

PUM

Property	Measurement	Unit
Surface tension	13.6	MN/M
Tension	13.6	mN/m

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