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End-material separation method

A separation method and end material technology, applied in the field of end material separation, can solve the problems of product damage, quality reduction, disconnection, etc.

Inactive Publication Date: 2019-03-05
MITSUBOSHI DIAMOND IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] When the auxiliary scribe lines are formed on the brittle material substrate in this way, the more the number of auxiliary scribe lines, the easier it is to take out the product; In the inside, etc., product damage or quality degradation occurs in the part where the auxiliary scribed line and its extension line are connected with the outline by scribed line
[0010] Also, as disclosed in Patent Document 2, if the auxiliary scribing lines are formed obliquely with respect to the scribing lines for outlines, it may be difficult to break along the scribing lines for outlines due to the arrangement of scribing lines for outlines formed on the substrate.

Method used

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Examples

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Embodiment Construction

[0034] A first embodiment of the method for separating an end material of the present invention will be described. Such as figure 1 As shown, in this embodiment, the brittle material substrate 10 is set as a single single-board substrate. Such as figure 1 As shown, in order to cut out a roughly rectangular product substrate 10A including a functional region with four corners set as arc-shaped curves and a straight line portion between these arc-shaped curves, the central part of the brittle material substrate 10 is first formed as an outline. Stroke 11 with a closed curve.

[0035] Next, in order to divide the brittle material substrate 10 into the product substrate 10A inside the outline scribe line 11 and the end material 10B outside, an auxiliary scribe line 12 is formed outside the product substrate 10A. The auxiliary scribe line 12 is not connected to the outline scribe line 11, and is formed perpendicularly to the adjacent outline scribe line 11 from the vicinity of t...

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Abstract

The present invention provides an end material separation method for minimizing the number of auxiliary scribed lines when a product substrate including a functional area is disconnected from a brittle material substrate by a contour scribed line. A contour scribe line (31) for forming a closed curve and two auxiliary scribe lines (32, 33) close to the contour scribe line (31) from an outer peripheral portion are formed on the surface of the brittle material substrate (30). When broken, the auxiliary scribe lines (32, 33) are first bent to advance the crack, and then the crack is advanced along the profile with the scribe line (31) to separate the end sheet (30B1). Subsequently, the product substrate (30A) can be removed from the brittle material substrate (30) without damage by opening the end material sheet (30B2) remaining on the periphery.

Description

technical field [0001] The present invention relates to an end material separation method for taking out a product part of a brittle material substrate by breaking an area enclosed by a closed curve and separating the end material. Background technique [0002] Generally, when scribing a brittle material substrate, it is mainly performed along a straight line, and the breaking is performed by applying a bending moment along the scribe line. However, when the shape to be cut is a circle, ellipse, etc., it is necessary to form a closed curved surface along the shape to be cut. In this case, there is a problem that it is difficult to cut along the scribed line. [0003] Patent Document 1 discloses that in order to cut out a product substrate from a substrate, an outline scribe line formed by a circular closed curve is formed, and an auxiliary scribe line is formed from the periphery of the scribe line toward the tangential direction without contacting the scribe line. [0004]...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28D1/32
CPCB28D1/327B26D7/018B26F3/002B28D5/0011B28D5/0082C03B33/02
Inventor 中川智子森亮
Owner MITSUBOSHI DIAMOND IND CO LTD