Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Chip temperature control system, chip temperature control method and reaction chamber

A temperature control system and wafer technology, applied in the manufacture of electrical components, circuits, semiconductor/solid-state devices, etc., can solve the problems of heating power consumption, production capacity reduction, temperature overshoot, etc., to improve temperature control speed and process uniformity , to avoid the effect of temperature overshoot

Active Publication Date: 2021-01-29
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] As the above heat exchange gas consumes heating power, this affects the temperature control speed of the wafer, thereby reducing the throughput
Moreover, in the above-mentioned stable ignition stage, the wafer is heated by the heater and the plasma at the same time, which will cause the wafer temperature to exceed the process target temperature T2, that is, the problem of temperature overshoot will occur, thereby affecting the process uniformity
It can be seen that the accuracy of wafer temperature control is low when the wafer is heated by the heater and the plasma simultaneously.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Chip temperature control system, chip temperature control method and reaction chamber
  • Chip temperature control system, chip temperature control method and reaction chamber
  • Chip temperature control system, chip temperature control method and reaction chamber

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0035] In order for those skilled in the art to better understand the technical solution of the present invention, the wafer temperature control system, wafer temperature control method and reaction chamber provided by the present invention will be described in detail below with reference to the accompanying drawings.

[0036] see figure 2 An embodiment of the present invention provides a wafer temperature control system, which includes a chuck 1 and a conveying device, wherein the chuck 1 is used to carry a wafer 2, and the chuck 1 is, for example, an electrostatic chuck or a mechanical chuck. Also, a heating device (not shown in the figure) for heating the wafer 2 is provided in the chuck 1 . The delivery device is used to deliver heat exchange gas to the gap 11 between the wafer 2 and the chuck 1 to exchange heat between the wafer 2 and the chuck 1 . The heat exchange gas is, for example, helium.

[0037] The above conveying device includes a conveying pipeline 3 for con...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a wafer temperature control system, a wafer temperature control method, and a reaction chamber. The wafer temperature control system includes a chuck for carrying a wafer, a heating device arranged in the chuck for heating the wafer, and a heating device for heating the wafer. The conveying device for conveying the heat exchange gas in the gap between the wafer and the chuck, the conveying device includes a conveying pipeline, and the conveying pipeline is used to convey the heat exchanging gas to the gap between the wafer and the chuck; There are temperature controllers for heating or cooling the heat exchange gas in the delivery line so that the heat exchange gas entering the gap between the wafer and the chuck reaches the target temperature. The wafer temperature control system provided by the invention can not only increase the temperature control speed of the wafer and increase the production capacity, but also can improve the accuracy of the wafer temperature control, thereby improving the uniformity of the process.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a wafer temperature control system, a wafer temperature control method and a reaction chamber. Background technique [0002] In the process of manufacturing integrated circuits, especially in the process of plasma etching (ETCH), physical vapor deposition (PVD), chemical vapor deposition (CVD), etc., in order to fix, support and transfer the wafer (Wafer) and realize To control the temperature of the wafer, an electrostatic chuck (Electro Static Chuck, ESC) is often used. Typically, the temperature of the wafer is controlled using a heater installed inside the electrostatic chuck. And, no matter what method is used to heat the wafer, it is necessary to pass a certain pressure of heat exchange gas, such as helium, into the gap between the upper surface of the electrostatic chuck and the lower surface of the wafer, so as to realize the gap between the electrost...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67
CPCH01L21/67098
Inventor 郑友山
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products