Manufacturing method of driving substrate, driving substrate, display panel and display device
A technology for driving substrates and manufacturing methods, which can be used in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., and can solve problems such as high cost, low transfer efficiency, and complicated operations.
Active Publication Date: 2021-03-19
BOE TECH GRP CO LTD +1
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Problems solved by technology
[0002] In the related art, the production of micro-LED (micro-LED) display panels adopts transfer printing technology. If the pixel density or pixel pitch of the display panel changes, it is necessary to replace the transfer head array at the corresponding interval, which is costly and complicated to operate.
[0003] In addition, since the pitch of the LED array on the wafer substrate is usually smaller than the pixel pitch of the display panel to be fabricated, multiple transfers are required to fabricate a display panel, and the transfer efficiency is low.
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[0034] Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many forms and should not be construed as limited to the examples set forth herein; the described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided in order to give a thorough understanding of embodiments of the present disclosure. However, those skilled in the art will appreciate that the technical solutions of the present disclosure may be practiced without one or more of the specific details being omitted, or other methods, components, devices, steps, etc. may be adopted.
[0035] It should be noted that in the drawings, the dimensions of layers and regions may be exaggerated for clarity of illustration. Also it will be understood that when an element or layer is referred to as being "on" another ...
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Provided are a drive substrate manufacturing method, a drive substrate, a display panel and a display device. The drive substrate manufacturing method comprises: providing a first chip array located on a wafer substrate, wherein the first chip array comprises chips in array arrangement at first intervals; providing a transfer head array arranged on an extendable substrate, wherein the transfer head array comprises transfer heads in array arrangement at second intervals; using the transfer head array before extending to pick up a second chip array from the wafer substrate, wherein chips of the second chip array are in array arrangement at third intervals; extending the extendable substrate such that the chips of the second chip array are arranged in array at fourth intervals; and releasing a target chip of the second chip array to a chip bonding position of the drive substrate, by means of the transfer head array after extending.
Description
technical field [0001] The present disclosure relates to the field of display technology, and in particular, to a method for manufacturing a driving substrate, a driving substrate, a display panel, and a display device. Background technique [0002] In the related art, the production of micro-LED (micro-LED) display panels adopts transfer printing technology. If the pixel density or pixel pitch of the display panel changes, it is necessary to replace the correspondingly spaced transfer head array, which is costly and complicated to operate. . [0003] In addition, since the pitch of the LED array on the wafer substrate is usually smaller than the pixel pitch of the display panel to be fabricated, multiple transfers are required to fabricate a display panel, and the transfer efficiency is low. [0004] Therefore, the technical solutions in the related art still have room for improvement. [0005] It should be noted that the information disclosed in the above background tech...
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IPC IPC(8): H01L21/67H01L27/15
CPCH01L21/67144H01L27/156
Inventor 张振华徐映嵩代伟男汪杨鹏
Owner BOE TECH GRP CO LTD