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A kind of antistatic bonding board and preparation method thereof

An anti-static and adhesive board technology, used in conductive coatings, fire-retardant coatings, coatings, etc., can solve the problems that circuit boards do not have anti-static functions, are prone to breakdown, and damage circuit boards, and improve the flame retardant effect. and other properties, the effect of reducing surface resistivity, preventing the generation and accumulation of static electricity

Active Publication Date: 2020-11-27
东莞市亚马电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the process of production, use and maintenance of electronic products, various polymer materials that are prone to static electricity will be used in large quantities, which undoubtedly brings more difficulties and challenges to the electrostatic protection of electronic products
As far as the circuit board is concerned, the traditional circuit board does not have anti-static function. Once the static electricity is accumulated and discharged, it is easy to break down and damage the circuit board.

Method used

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  • A kind of antistatic bonding board and preparation method thereof
  • A kind of antistatic bonding board and preparation method thereof
  • A kind of antistatic bonding board and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] An antistatic bonding board, comprising a substrate layer and an antistatic layer adhered to the substrate layer, the antistatic layer comprising the following raw materials in parts by weight:

[0037]

[0038] The preparation method of every part of described modified melamine resin comprises the steps:

[0039] (A1), take by weight 129 parts of melamine, 68 parts of formaldehyde-water solution with a mass fraction of 38%, 155 parts of modifying agent, 2 parts of crosslinking agent and 190 parts of water, set aside;

[0040] (A2) Take modifier and add alkalinity regulator, adjust pH value to 10, keep warm at 104°C for 30min, then add formaldehyde-water solution and cross-linking agent and mix evenly to obtain pre-cross-linking solution;

[0041] (A3) Add melamine to the pre-crosslinking solution in step (A2), stir at 90° C. for 45 min, dilute with water, and cool to obtain a modified melamine resin.

[0042] The modifying agent is sucrose-water solution with a mas...

Embodiment 2

[0054] An antistatic bonding board, comprising a substrate layer and an antistatic layer adhered to the substrate layer, the antistatic layer comprising the following raw materials in parts by weight:

[0055]

[0056] The preparation method of every part of described modified melamine resin comprises the steps:

[0057] (A1), take by weight 123 parts of melamine, 60 parts of formaldehyde-water solution with a mass fraction of 35%, 121 parts of modifying agent, 1 part of crosslinking agent and 185 parts of water, set aside;

[0058] (A2), take the modifier and add the alkalinity regulator, adjust the pH value to 9.5, keep it warm at 98°C for 25 minutes, then add formaldehyde-water solution and cross-linking agent and mix evenly to obtain the pre-cross-linking liquid;

[0059] (A3) Add melamine to the pre-crosslinking solution in step (A2), stir at 85° C. for 30 min, dilute with water, and cool to obtain a modified melamine resin.

[0060] The modifying agent is sucrose-wat...

Embodiment 3

[0072] An antistatic bonding board, comprising a substrate layer and an antistatic layer adhered to the substrate layer, the antistatic layer comprising the following raw materials in parts by weight:

[0073]

[0074]

[0075] The preparation method of every part of described modified melamine resin comprises the steps:

[0076] (A1), take by weight 135 parts of melamine, 75 parts of formaldehyde-water solution with a mass fraction of 40%, 198 parts of modifying agent, 3.5 parts of crosslinking agent and 200 parts of water, set aside;

[0077] (A2), take modifier and add alkalinity regulator, adjust pH value to 10.5, keep warm at 110°C for 35min, then add formaldehyde-water solution and cross-linking agent and mix evenly to obtain pre-cross-linking liquid;

[0078] (A3) Add melamine to the pre-crosslinking solution in step (A2), stir at 95° C. for 60 min, dilute with water, and cool to obtain a modified melamine resin.

[0079] The modifying agent is sucrose-water solu...

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Abstract

The invention relates to the technical field of antistatic products, in particular to an antistatic adhesion board and a method for preparing the same. The antistatic adhesion board comprises base board layers and antistatic layers. The antistatic layers are adhered to the base board layers and comprise modified melamine resin, waterborne polyurethane, leveling agents, defoaming agents, antistaticagents, flame retardants, curing agents, coupling agents and fillers. The antistatic adhesion board and the method have the advantages that the antistatic layers are adhered to the base board layersinstead of the traditional electrostatic-sensitive material layers, and accordingly electrostatic generation and accumulation can be prevented; the antistatic adhesion board further can be processed to obtain circuit boards, electrostatic accumulation can be prevented, and accordingly circuit board damage due to electrostatic accumulation and discharge in circuit board production and use procedures can be prevented.

Description

technical field [0001] The invention relates to the technical field of antistatic products, in particular to an antistatic bonding board and a preparation method thereof. Background technique [0002] Static electricity and electrostatic discharge are ubiquitous in our daily life, but for electronic devices, a slight electrostatic discharge that we cannot detect may cause serious damage to it. The rapid development of electronic technology has made electronic products more and more powerful, but their volume is getting smaller and smaller, but this is at the expense of the increasing electrostatic sensitivity of electronic components. This is because the high integration level means that the unit lines will become narrower and narrower, and the ability to withstand electrostatic discharge will become worse and worse. In addition, the materials used in a large number of new special devices are also electrostatic sensitive materials, so that electronic components Devices, esp...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09D161/32C09D175/04C09D5/24C09D5/18C09D7/61B05D7/14
CPCB05D7/14C08K2003/085C08K2003/0856C08K2003/2224C08K2003/2227C08K2003/387C09D5/18C09D5/24C09D7/61C09D161/32C08L75/04C08K5/20C08K3/38C08K3/22C08K3/36C08K3/34C08K3/08C08K3/04C08K3/00
Inventor 张光明
Owner 东莞市亚马电子有限公司