Heat transfer coefficient test apparatus and heat transfer coefficient measuring method

A thermal conductivity and testing device technology, which is applied in the field of measurement, can solve the problems of high device complexity and difficulty in thermal conductivity, and achieve the effects of improving operability, accurately measuring heat transfer power, and avoiding errors

Inactive Publication Date: 2019-03-19
DATANG MOBILE COMM EQUIP CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0013] This application provides a thermal conductivity test device and a method for measuring thermal conductivity, which are used to solve the technical problems of the difficulty in realizing the measurement of thermal conductivity and the high complexity of the device in the prior art

Method used

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  • Heat transfer coefficient test apparatus and heat transfer coefficient measuring method
  • Heat transfer coefficient test apparatus and heat transfer coefficient measuring method
  • Heat transfer coefficient test apparatus and heat transfer coefficient measuring method

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Embodiment 2

[0074] Such as image 3 As shown, in combination with the device provided in Embodiment 1, the embodiment of the present application also provides a method for measuring the thermal conductivity of a sample using the thermal conductivity testing device provided in Embodiment 1. The method includes steps:

[0075] In step 301, the standard test piece and the tested piece are heated, and when the system is in a stable state, the temperatures of the set components in the comparison reference component 7 and the component to be tested 8 are obtained.

[0076] Wherein, comparing the temperature of the set components in the reference component 7 and the component to be tested 8 includes: the temperature T of the first heat dissipation plate 0 , the temperature T of the second cooling plate 0 ′, the upper surface temperature T of the standard test piece 1 , the temperature T of the lower surface 2 , the upper surface temperature T of the tested piece 1 ’ and the temperature T of ...

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Abstract

The application discloses a heat transfer coefficient test apparatus and a heat transfer coefficient measuring method. The heat transfer coefficient test apparatus comprises: a protective component including a first portion in U shape and a second portion inside the first portion; a heating component arranged at the bottom of the first portion, wherein the second portion divides a receiving spaceformed by the first portion into two receiving spaces to receive a comparison reference component and a component under test; the comparison reference component and the component under test which respectively include a heating plate, a standard test piece, a piece under test and a heat-dissipating plate which are arranged in stacked manner; temperature measuring components arranged on the upper and lower surfaces of the standard piece and the piece under test in order to monitor changes in the surface temperatures of the standard piece and the piece under test. The apparatus and method disclosed herein help solve the technical problems that measurement of heat transfer coefficient in the prior art is highly difficult and equipment of the prior art is highly complex.

Description

technical field [0001] The present application relates to the field of measurement technology, in particular to a thermal conductivity testing device and a method for measuring thermal conductivity. Background technique [0002] With the development of high integration and miniaturization of electronic equipment, the problem of heat dissipation is particularly important. In thermal design, it is often necessary to consider the heat conduction between power devices and heat sinks, and insulating and heat-conducting materials have become their preferred transfer medium, which provides powerful heat dissipation measures for the high integration of electronic equipment, as well as ultra-small and ultra-thin. More and more products begin to use insulating and heat-conducting materials to improve heat dissipation efficiency and meet reliability requirements. Therefore, in thermal design, it is an essential requirement to obtain the steady-state thermal performance parameters of i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N25/20
CPCG01N25/20
Inventor 张艾艾丁金德
Owner DATANG MOBILE COMM EQUIP CO LTD
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