Device packaging method and flexible device

Abstract

An embodiment of the present invention provides a device packaging method and a flexible device, which are used to improve the packaging performance of the device, including: step 1, placing the substrate in a growth device, and the growth device includes an upper electrode and a lower electrode; step 2, controlling the growth The growth conditions of the device, under the action of the upper electrode and the lower electrode, the reactant generates a concave-convex layer on the substrate; wherein, the reactant matches the material of the concave-convex layer, and the shape of the concave-convex layer is set by the medium of the lower electrode. Determined by the array; step 3, repeating step 2 until an encapsulation layer that meets the encapsulation requirements is generated, and the contacting concave and convex surfaces in the encapsulation layer are combined with each other. Adopting this technical scheme can obtain a packaging layer containing multiple concave-convex layers. The concave-convex layer in the packaging layer can fully release the stress in the packaging layer, thereby improving the flexibility of the packaging layer. Therefore, the technology provided by the embodiment of the present invention is adopted The packaging scheme can improve the packaging performance of the device.

Description

technical field [0001] The invention relates to the field of electronic science and technology, in particular to a device packaging method and a flexible device. Background technique [0002] Packaging is an important step in the semiconductor manufacturing process, and packaging performance can seriously affect the performance of device products. Moreover, for most semiconductor electronic devices, packaging is required to provide it with a relatively stable working environment isolated from the outside world. Therefore, packaging is also a protection for semiconductor electronic devices, for example, to isolate water vapor in the air and air to the device. The oxidation of the device can delay the aging of the device, or, resisting the change of the external temperature can not only delay the aging of the device, but also ensure the stable working performance of the device. [0003] However, the packaging effect of the existing packaging technology is not satisfactory whe...

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Problems solved by technology

[0004] figure 1 It is a schematic diagram of a single-layer film packaging structure in the prior art, such as figure 1 As shown, directly covering the OLED to be packaged with a single-layer material film, although this packaging method is simple, the packaging effect is not ideal, the stress in the single-layer material film is relatively large, and the packaging performance cannot meet the packaging requirements of flexible devices.

[0005] figure 2 It is a schematic diagram of an organic-inorganic composite film packaging structure in the prior art, image 3 It is a schematic diagram of an inorganic composite thin film packaging structure in the prior art. This structure has a limited effect on stress relief, so it also limits the improvement of packaging performance.

[0006] In summary, the existing flexible device packaging structure has the problem of low packaging performance

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