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Laser treatment method, bonding method, copper member, method for manufacturing multilayer print wiring substrate, and multilayer print wiring substrate

A laser processing and component technology, which is applied in printed circuit manufacturing, laser welding equipment, improvement of metal adhesion of insulating substrates, etc., can solve problems such as difficulty in improving joint adhesion, insufficient resin and metal adhesion, resin cracks

Inactive Publication Date: 2019-03-19
FURUKAWA ELECTRIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] In general, it is difficult to improve the adhesiveness of the joint part for components obtained by combining dissimilar materials. For example, in the semiconductor package structure in which the base material is molded with resin, there are problems such as the following problems: the adhesion between resin and metal is particularly difficult. Insufficient at high temperature, or due to the difference in thermal expansion coefficient between the resin and the lead frame (metal), or the expansion of moisture in the package, resin cracks and chip peeling occur

Method used

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  • Laser treatment method, bonding method, copper member, method for manufacturing multilayer print wiring substrate, and multilayer print wiring substrate
  • Laser treatment method, bonding method, copper member, method for manufacturing multilayer print wiring substrate, and multilayer print wiring substrate
  • Laser treatment method, bonding method, copper member, method for manufacturing multilayer print wiring substrate, and multilayer print wiring substrate

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Embodiment Construction

[0044] A specific example is shown and demonstrated about the form (henceforth this embodiment) for carrying out this invention. This embodiment relates to a laser treatment method for surface treatment of a copper surface using a laser.

[0045] figure 1 It is a figure which schematically shows the laser processing process of surface-treating a copper surface with a laser. In the laser processing step according to the present embodiment, the copper surface 11 of the copper member 10 is irradiated with pulsed laser light whose pulse width is managed in the order of nanoseconds in a region of high energy density that has not been studied before. Specifically, as figure 1 As shown in , the copper surface 11 of the copper component 10 is irradiated with a pulse laser 2 whose laser power is near the threshold value capable of processing copper and whose pulse width is nanoseconds. The nanosecond order means, for example, the range of 0.8 ns to 5.0 ns. In addition, the energy d...

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Abstract

The present invention provides a laser treatment method including a step for surface-treating a copper surface by using laser, wherein a copper surface (11) is irradiated with a pulse laser (2) havinga laser power that is near a threshold, at which the machining of a copper foil (10) is possible, and having a nano-order-second pulse width, in order to form a laser-wavelength-order periodic structure (12) on the copper surface (11), and also form a coating (13) on the copper surface (11). This enables the copper surface to be machined to exhibit favorable electrical characteristics and favorable adhesion to a resin material.

Description

technical field [0001] The present invention relates to a laser treatment method for processing a copper surface with a laser, a joining method for joining a copper foil and a resin material, and a surface-treated copper part. Background technique [0002] With the rapid development of various industries such as electronics and automobiles, and the continuous progress of material diversification and high functionality, especially from the perspective of weight reduction of parts, improvement of design freedom, and cost reduction, etc., the use of Demand for parts in which dissimilar materials such as resins and metals are effectively combined is expanding. [0003] In general, it is difficult to improve the adhesiveness of the joint part for components obtained by combining dissimilar materials. For example, in the semiconductor package structure in which the base material is molded with resin, there are problems such as the following problems: the adhesion between resin and...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/354C23C26/00H05K3/00H05K3/38
CPCC23C26/00H05K3/00H05K3/38B23K26/354B23K2103/12B23K2103/166B23K2101/42B23K26/0626B23K26/364H05K3/4652
Inventor 岩间真木松下俊一
Owner FURUKAWA ELECTRIC CO LTD