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Tin-based binary eutectic alloy microstructure simulation and finite element solution analysis method

A binary eutectic, microstructure technology, applied in the direction of instrumentation, design optimization/simulation, calculation, etc., can solve problems such as inability to achieve solution analysis, achieve fast loading solution and analysis, improve modeling efficiency, programming and processing convenience Effect

Active Publication Date: 2019-03-26
GUILIN UNIV OF ELECTRONIC TECH
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Problems solved by technology

However, these methods cannot realize the solution analysis under complex physical and mechanical loads

Method used

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  • Tin-based binary eutectic alloy microstructure simulation and finite element solution analysis method
  • Tin-based binary eutectic alloy microstructure simulation and finite element solution analysis method
  • Tin-based binary eutectic alloy microstructure simulation and finite element solution analysis method

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Embodiment 1

[0071] details as follows figure 1 As shown, the simulation of SnBi binary eutectic alloy microstructure and the finite element solution analysis method include the following steps:

[0072] S1: Generate an initial model. The initial model consists of a 150×150 (i.e. m=150, n=150) array of sites, where the sites represent domains with lattice orientations, which are assigned random values ​​between 1 and 10 or -1 and -10 (ie Q=10) to indicate the orientation of the grains. Sites representing the Sn phase are assigned positive orientations (i.e., 1 to 10). The site representing the Bi phase is assigned a negative integer in the interval from -10 to -1 (ie, -10 to -1); then the initial numerical model is randomly generated according to the phase ratio of the real object, because the two phases of SnBi in the eutectic structure The volume ratio is 1:1.03, the probability of Sn phase is 49.26%, and the probability of Bi phase is 50.74%. The generated random matrix is ​​(partia...

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Abstract

The invention discloses a tin-based binary eutectic alloy microstructure simulation and finite element solution analysis method, and relates to the field of computational material science. According to the method, the simulated eutectic structure is extremely similar to the eutectic structure acquired by an experimental instrument in shape, and the loading, solving and analysis of the eutectic structure can be realized on mainstream finite element CAE software and platforms (such as ANSYS, MARC, ABAQUS, MSC / PATRAN, COMSOL and the like); According to the method, the defects of the existing tin-based binary eutectic alloy microstructure detection technology can be overcome, and representation of the physical and mechanical behaviors of the microstructure of the tin-based binary eutectic alloy is achieved. According to the method, a Monte Carlo method and a finite element method are combined, the modeling efficiency of the eutectic structure is improved, loading solving and analysis of the eutectic structure are achieved, a new method is provided for feature analysis and reliability analysis of the eutectic structure, and the problems of microstructure modeling and performance characterization of the eutectic structure are well solved.

Description

technical field [0001] The invention relates to the field of computational material science, and in particular to a method for simulating and finite element analysis of the microstructure of a tin-based binary eutectic alloy. Background technique [0002] Tin-based binary eutectic alloy solder is widely used in micro-interconnection solder joints of electronic components and equipment. With the continuous development of high-density packaging technology in the electronics industry, the trend of miniaturization of electronic devices and systems is becoming more and more obvious, resulting in the continuous reduction of the size of solder joints, and the solder matrix of solder joints presents an obvious microstructure (binary eutectic tissue, a mixture of two solid-phase mechanisms) inhomogeneity. Researchers at home and abroad generally believe that solder joints are the weakest part of electronic products and equipment. The study found that the inhomogeneity of the binary...

Claims

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Application Information

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IPC IPC(8): G06F17/50
CPCG06F30/23Y02P90/30
Inventor 秦红波刘天寒郭磊文泉璋李祎康梁正超
Owner GUILIN UNIV OF ELECTRONIC TECH
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