A kind of preparation method of graphene
A technology of graphene and organic salts, which is applied in the field of graphene material preparation, can solve the problems of high preparation cost, and achieve the effects of fewer carbon atomic layers, lower system energy, and larger area
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0021] At room temperature, dissolve copper oleate containing divalent copper in a mixed solvent of oleic acid and n-octanol to make a copper-containing organic salt solution with a copper concentration of 0.001mol / L; The solution was placed in a nitrogen atmosphere, heated at normal pressure, and the gas flow rate was 75mL min -1 , the heating rate is 5°C / min, when it is heated to 250°C, it is kept for 30 minutes to form an area of 3-4cm 2 graphene-copper composites. A single crystal silicon wafer is selected as the substrate, and the resulting graphene-copper composite material is transferred. The specific transfer method is as follows: the surface of the silicon wafer is placed obliquely, and the gas-liquid interface formed between the copper-containing organic salt solution and the protective atmosphere side, gradually approaching the surface of the graphene-copper composite material formed at the gas-liquid interface, until the contact, the graphene-copper composite ma...
Embodiment 2
[0024] At room temperature, dissolve copper oleate containing divalent copper in a mixed solvent of oleic acid and n-octanol to prepare a copper-containing organic salt solution with a copper concentration of 0.02mol / L; The solution was placed in a nitrogen atmosphere, heated at normal pressure, and the gas flow rate was 75mL min -1 , the heating rate is 5°C / min, when it is heated to 250°C, it is kept for 30 minutes to form an area of 3-4cm 2 graphene-copper composites. A single crystal silicon wafer is selected as the substrate, and the resulting graphene-copper composite material is transferred. The specific transfer method is as follows: the surface of the silicon wafer is placed obliquely, and the gas-liquid interface formed between the copper-containing organic salt solution and the protective atmosphere side, gradually approaching the surface of the graphene-copper composite material formed at the gas-liquid interface, until the contact, the graphene-copper composite ...
Embodiment 3
[0027] At room temperature, dissolve copper oleate containing divalent copper in a mixed solvent of oleic acid and n-octanol to make a copper-containing organic salt solution with a copper concentration of 0.001mol / L; The solution was placed in a nitrogen atmosphere, heated at normal pressure, and the gas flow rate was 75mL min -1, the heating rate is 5°C / min, when heated to 150°C, keep warm for 30min, and the forming area reaches 0.5-1cm 2 graphene-copper composites. A single crystal silicon wafer is selected as the substrate, and the resulting graphene-copper composite material is transferred. The specific transfer method is as follows: the surface of the silicon wafer is placed obliquely, and the gas-liquid interface formed between the copper-containing organic salt solution and the protective atmosphere side, gradually approaching the surface of the graphene-copper composite material formed at the gas-liquid interface, until the contact, the graphene-copper composite mate...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More