Heat dissipation substrate, device and manufacturing method for heat dissipation substrate
A technology of heat dissipation substrate and manufacturing method, which is applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problems of increased manufacturing cost of heat dissipation substrate, reduction of heat dissipation of heat dissipation substrate, and unestablishment, and achieves excellent heat dissipation efficiency, insulation and Excellent heat dissipation and reduced warpage
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Embodiment approach
[0144] This heat dissipation substrate may be manufactured by performing a correction step after formation to correct warpage as in the above embodiment, or may be manufactured while adjusting the thickness of the inorganic material layer to reduce warpage. In this case, there is no need to adjust warpage after manufacture.
[0145] Alternatively, the coating may be laminated after the rectification step. In this way, by laminating the coating layer after the warpage is corrected, microcracks generated in the inorganic material layer can be filled with the coating layer, and the insulation of the heat dissipation substrate can be efficiently improved.
[0146] [Other implementations]
[0147] The heat dissipation substrate, the device, and the method of manufacturing the heat dissipation substrate are not limited to the embodiments described above.
[0148] The heat dissipation substrate may have multiple layers of base materials or inorganic material layers in the thickness d...
Embodiment 1
[0153]
[0154] An aluminum plate (industrial pure aluminum 1050, average thickness 2 mm) as a base material was cut into a length of 50 mm and a width of 50 mm using a shirring processing machine, and the surface was cleaned with a neutral detergent.
[0155] Next, using a ball mill, low-melting phosphate glass flakes (flake) ("VQ0028" of Nippon Frit Co., Ltd.), which is phosphate glass, were pulverized so that the median particle size became 20 μm, and viscous glass was obtained. mixture particles. Alumina filler ("round alumina AS-30" of Showa Denko Co., Ltd., median diameter: 20 μm) was mixed as a filler into the binder particles at a mass ratio of 50:50. Water was added to the mixture and stirred to prepare an inorganic layer composition. The solid content concentration of this composition for inorganic substance layers was 60 mass %.
[0156] Next, low-melting-point phosphate glass chips ("VQ0028" of Nippon Frit Co., Ltd.) were pulverized using a jet mill so that the...
Embodiment 2 and 3
[0164] A heat dissipation substrate was obtained in the same manner as in Example 1 except that the type of the siloxane compound to be used and the drying temperature during coating formation were as described in Table 1.
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Abstract
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