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Lower grinding mechanism of uniform heat dissipation dynamic grinding machine

A uniform heat dissipation and grinding machine technology, which is applied in the direction of grinding machine tools, grinding machine parts, grinding devices, etc., can solve the problems that affect the service life of the equipment and the grinding effect, the grinding is not in place, and the cooling effect is poor, so as to improve the service life and grinding effect, improve the grinding effect, eliminate the effect of thermal stress

Pending Publication Date: 2019-04-05
刘海
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Problems solved by technology

The existing grinding machine has the following disadvantages: 1. The lower grinding disc can only rotate by itself, resulting in a relatively concentrated grinding surface, which is prone to local areas where the grinding is not in place; 2. A large amount of heat is generated during the grinding process, and the thermal stress is highly concentrated. The cooling effect Poor, often cause damage to the grinding surface, affecting the service life of the equipment and the grinding effect

Method used

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  • Lower grinding mechanism of uniform heat dissipation dynamic grinding machine
  • Lower grinding mechanism of uniform heat dissipation dynamic grinding machine
  • Lower grinding mechanism of uniform heat dissipation dynamic grinding machine

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Embodiment Construction

[0017] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be described in detail below in conjunction with the accompanying drawings. The description in this part is only exemplary and explanatory, and should not have any limiting effect on the protection scope of the present invention. .

[0018] like Figure 1-Figure 4 As shown, the specific structure of the present invention is: it comprises a lower grinding disc assembly, a single-row planetary gear mechanism and a water cooling system, the lower grinding disc assembly includes a lower grinding disc 6 and a lower grinding disc seat 5, and the lower grinding disc 6 and the lower grinding disc seat 5 are arranged between There is a water-cooling channel, and the lower grinding disc 6 is directly used as the planetary gear in the single-row planetary gear mechanism. The sun gear in the single-row planetary gear mechanism is connected thr...

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Abstract

A lower grinding disc assembly, a single-row planet gear mechanism and a water cooling system are included. A lower grinding disc is directly used as a planet gear in the single-row planet gear mechanism. A sun gear in the single-row planet gear mechanism is connected through a first drive mechanism. A planet gear and a gear ring in the single-row planet gear mechanism are connected with a seconddrive mechanism. A water cooling channel is connected with the water cooling system. The first drive mechanism drives the sun gear to rotate, the sun gear drives the planet gear and the lower grindingdisc assembly on the planet gear to conduct self-rotation, and the second drive mechanism drives the planet gear and the gear ring to conduct revolution. The lower grinding assembly can conduct self-rotation and revolution, self-rotation and revolution run in the manner of the single-row planet gear mechanism, the lower grinding disc is stable and cannot shake, and the grinding effect is improved. Meanwhile, the lower grinding disc can conduct water cooling heat dissipation in the self-rotation and revolution process, heat stress is eliminated, the service life of equipment is prolonged, andthe grinding effect of the equipment is improved.

Description

technical field [0001] The invention relates to a lower grinding mechanism of a dynamic grinding machine with uniform heat dissipation. Background technique [0002] The grinding machine is mainly used for deburring, surface rust treatment, surface polishing and grinding cleaning of products, and is widely used in various fields. The existing grinding machine has the following disadvantages: 1. The lower grinding disc can only rotate by itself, resulting in a relatively concentrated grinding surface, which is prone to local areas where the grinding is not in place; 2. A large amount of heat is generated during the grinding process, and the thermal stress is highly concentrated. The cooling effect Poor, often cause damage to the grinding surface, affecting the service life of the equipment and the grinding effect. Contents of the invention [0003] The object of the present invention is to solve the above problems and provide a lower grinding mechanism of a dynamic grindin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/11B24B37/34B24B55/02B24B47/12
CPCB24B37/11B24B37/34B24B47/12B24B55/02
Inventor 刘海
Owner 刘海
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