Method for measuring the line width or the line spacing minimum distance of a high-density flexible printed substrate

A flexible printed substrate and flexible printing technology, applied in image data processing, instruments, calculations, etc., can solve problems such as heavy tasks, high difficulty, and error-prone, and achieve the effect of improving measurement accuracy and facilitating control

Active Publication Date: 2019-04-05
SOUTH CHINA UNIV OF TECH
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  • Claims
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AI Technical Summary

Problems solved by technology

At present, the common detection method of domestic FICS manufacturers is to ensure the pass rate of products through manual visual inspection. However, for finished boards with a finished product smaller than 10um, manual visual inspection requires the use of a microscope to carefully check important positions, which is difficult to operate and heavy tasks. error prone

Method used

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  • Method for measuring the line width or the line spacing minimum distance of a high-density flexible printed substrate
  • Method for measuring the line width or the line spacing minimum distance of a high-density flexible printed substrate
  • Method for measuring the line width or the line spacing minimum distance of a high-density flexible printed substrate

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Embodiment

[0046] Such as Figure 1-Figure 4 As shown, a method for measuring the line width of a high-density flexible printed substrate or the minimum distance between lines includes the following steps:

[0047] S1 for the collected images of high-density flexible printed substrates such as Figure 5 As shown, the median filtering and morphological filling processing are performed in sequence; the processed image is as follows Figure 6 As shown, this step plays the role of enhancing the image of the flexible substrate, removing noise, protecting the edges, and reducing the adverse effects of oxidation on the flexible substrate.

[0048] S2 uses the curve evolution theory and level set method to segment the processed image, and extracts the boundary coordinates of the wire, such as Figure 7 As shown, in this step, the variational method is used to minimize the energy functional, and the evolution level set function is driven. When the iteration condition is satisfied, the zero leve...

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Abstract

The invention discloses a method for measuring the line width or the line spacing minimum distance of a high-density flexible printed substrate. The method comprises the following steps of: 1, carrying out median filtering and morphological filling processing on an acquired high-density flexible printed substrate image; 2, segmenting the processed image based on a curve evolution theory and a level set method, and extracting boundary coordinates; Step 3, carrying out B spline curve fitting on the wire coordinates; And 4, solving the minimum distance between the parameter curves based on a particle swarm algorithm. According to the method, a curve evolution theory and a level set method are adopted for segmentation, curve topological structure changes can be naturally processed, stable andaccurate numerical calculation is achieved, an energy functional is constructed through local information of an image, and the phenomenon of image gray scale nonuniformity can be effectively processed.

Description

technical field [0001] The invention relates to the fields of high-density flexible printed substrate manufacturing and non-destructive measurement, in particular to a method for measuring the line width or the minimum distance between lines of a high-density flexible printed substrate. Background technique [0002] High-density flexible printed circuit boards (FICS) have the advantages of good flexibility, thin thickness, light weight, and small size, and are widely used in electronics, military and other industries. With the development of science and technology, the density of FICS lines is getting higher and higher, and the measurement of line width and line spacing in the production process has become particularly difficult. At present, the common detection method of domestic FICS manufacturers is to ensure the pass rate of products through manual visual inspection. However, for finished boards with a finished product smaller than 10um, manual visual inspection requires...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06T7/00G06T7/10
CPCG06T7/0004G06T7/10
Inventor 胡跃明黄丹
Owner SOUTH CHINA UNIV OF TECH
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