Display substrate and preparation method thereof and display device
A technology for display substrates and display devices, applied to identification devices, removal of conductive materials by chemical/electrolytic methods, details of conductive pattern layout, etc., can solve the problems of lower reliability of display panels and lower pull-out force of display modules, etc.
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no. 1 example
[0028] The invention provides a display substrate.
[0029] Such as figure 1 As shown, in one embodiment, the display substrate includes a base substrate 101 and a conductive pattern 102 formed on the base substrate 101. The area of the surface of the conductive pattern 102 away from the base substrate 101 is larger than that of the conductive pattern 102 on the base substrate. The area of the orthographic projection on 101.
[0030] In this embodiment, the display substrate is matched with COF301A (Chip On Film, chip on film) or COG301B (chip onglass, glass substrate chip), etc., and the conductive pattern 102 of the display substrate passes through ACF glue 200 (AnisotropicConductive Film, anisotropic Conductive glue) is bonded to the corresponding raised conductive structure 302 (Bump) on COF301A or COG301B.
[0031] In this embodiment, the surface of the conductive pattern 102 away from the base substrate 101 refers to the surface of the conductive pattern 102 facing...
no. 2 example
[0042] This embodiment provides a display device, including any one of the above display substrates.
[0043] Among them, the display device may include: mobile phone, tablet computer, e-book reader, MP3 player, MP4 player, digital camera, laptop computer, vehicle computer, desktop computer, set-top box, smart TV, wearable device at least one of the .
[0044] Since the technical solution of this embodiment includes all the technical solutions of the above-mentioned embodiments, at least all the above-mentioned technical effects can be achieved, and details will not be repeated here.
[0045] Further, such as image 3 with Figure 4 As shown, the display device also includes COF301A or COG301B connected to the display substrate through ACF glue 200. The ACF glue 200 includes glue 201 and conductive balls 202. When the conductive pattern 102 includes a plurality of grooves 1021, the conductive balls 202 The diameter is greater than the depth of the groove 1021 .
[0046] Fu...
no. 3 example
[0052] The present invention provides a method for preparing a display substrate, including providing a base substrate 101, and forming a conductive pattern 102 on the base substrate 101, and the method further includes:
[0053] Roughening treatment is performed on the surface of the conductive pattern 102 away from the base substrate 101 .
[0054] Wherein, the purpose of roughening the surface of the conductive pattern 102 is to make the area of the surface of the conductive pattern 102 away from the base substrate 101 larger than the area of the orthographic projection of the conductive pattern 102 on the base substrate 101 .
[0055] It should be understood that for a large-sized surface, such as a millimeter-level or centimeter-sized surface, its surface area can be increased by changing its surface shape while ensuring the surface finish. For the conductive pattern 102 used in the bonding structure, its size is usually at the nanometer level or micron level, and its...
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