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A lamp bead welding method

A welding method and lamp bead technology, applied in the directions of printed circuits, electrical components, printed circuit manufacturing, etc., can solve the problems of the inclined position of the chip, the increase of thermal resistance, and the offset, so as to ensure the welding yield, improve the accuracy and efficiency. high effect

Active Publication Date: 2020-12-01
FUJIAN HONGBO OPTO ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, due to the shrinkage of the solder paste when it melts at high temperature, it will cause the chip to tilt or position shift, which will lead to the increase of thermal resistance and affect the heat dissipation of the LED, the lamp bead not bright or short circuit, etc., especially for the smaller size of Mini LED and Micro LED, it is more difficult to control its soldering yield

Method used

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  • A lamp bead welding method
  • A lamp bead welding method

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Embodiment 1

[0043] Please refer to figure 1 with figure 2 , a lamp bead welding method, comprising steps:

[0044] Coating solder paste on the circuit of the substrate 5;

[0045] The described coating of solder paste on the substrate 5 circuit is specifically:

[0046] Apply die-bonding solder paste on the circuit that needs to be soldered on the substrate 5;

[0047] Stretching the transparent film provided with a plurality of lamp beads 3 according to the arrangement of the circuits of the substrate 5, so that the arrangement of the plurality of lamp beads 3 is consistent with the arrangement of the circuits of the substrate 5;

[0048] According to the arrangement of the circuit of the substrate 5, stretching the transparent film provided with a plurality of lamp beads 3, so that the arrangement of the plurality of lamp beads 3 is consistent with the arrangement of the circuit of the substrate 5 is as follows:

[0049] Stretching the transparent film provided with a plurality of ...

Embodiment 2

[0060] This embodiment will further illustrate how the above lamp bead welding method of the present invention is realized in combination with specific application scenarios:

[0061] 1. Apply die-bonding solder paste on the circuit to be soldered on the substrate 5;

[0062] Specifically, a traditional coating machine can be used to coat the crystal-bonding solder paste, and different dosages of the crystal-bonding solder paste can be selected according to different models of the LED lamp bead 3;

[0063] 2. Stretch the transparent film provided with a plurality of LED lamp beads 3 in a crystal-expanding manner according to the arrangement of the circuits of the substrate 5, so that the arrangement of the plurality of LED lamp beads 3 is consistent with the arrangement of the circuits of the substrate 5;

[0064] Specifically, the range and shape of the stretched transparent film of the crystal expander can be set according to the arrangement of the basic lines, so as to ensu...

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Abstract

The present invention provides a lamp bead welding method. A substrate circuit is coated with solder paste; according to the arrangement of the substrate circuit, a transparent film provided with a plurality of lamp beads is stretched to allow the arrangement of the plurality of lamp beads to be consistent to the arrangement of the substrate circuit; the stretched transparent film is transferred onto the substrate circuit coated with the solder paste for welding with no need for employing a chip mounter to pick up the lamp beads in order and putting the lamp beads on the substrate circuit coated with the solder paste, the efficiency is higher, the lamp beads are uniformly arranged on the same transparent film in the welding process, there are interaction forces between different lamp beadsto offset the contraction force generated when the solder paste melts at a high temperature, thereby effectively improving the precision of the lamp bead welding an ensuring the welding yield.

Description

technical field [0001] The invention relates to the technical field of electronic components, in particular to a lamp bead welding method. Background technique [0002] With the rapid development of the small-pitch display market and higher and higher requirements for display technology, the advantages of Mini LED and Micro LED technology in the display field have become increasingly difficult for industry players to ignore. Mini LED display and Micro LED display will be more advanced display technologies, and they will also be the development trend of future display applications. However, due to the small size of Mini LED and Micro LED, it is difficult to control the welding yield. The reason is that they cannot be identified and repaired online, which is the main factor limiting their development at present. [0003] At present, reflow soldering is usually used for the welding of LED lamp beads. First, apply solder paste on the circuit that needs to be soldered on the sub...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/34
CPCH05K3/341
Inventor 陈庆美何剑飞赵煜楗
Owner FUJIAN HONGBO OPTO ELECTRONICS TECH CO LTD
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