Cutting method of semiconductor elements and manufacturing method

Abstract

The invention provides a cutting method of semiconductor elements and a manufacturing method. The cutting method of the semiconductor elements comprises the following steps: providing a substrate including a plurality of semiconductor elements; chip pasting: adhering a chip pasting film with the bottom surface of the substrate; covering protective films with the semiconductor elements; invisible cutting: forming an altering layer structure in the substrate; performing splitting to obtain the semiconductor elements which are separated from each other. According to the cutting method disclosed by the invention, the problem that the semiconductor elements in the cutting process can be dropped can be solved, so that the production yield and the operation efficiency are effectively improved, and meanwhile, the cutting method disclosed by the invention is simple and stable in process, is high in operability, and can be industrially popularized and applied.

Description

technical field [0001] The invention relates to the field of semiconductors, in particular to a cutting method and a manufacturing method of a semiconductor element. Background technique [0002] In recent years, the semiconductor industry, which manufactures highly integrated and high-performance semiconductor products, has successively developed semiconductor wafer processing technology. In order to improve production efficiency, semiconductor products everywhere use semiconductor wafer processing technology to integrate several to tens of millions of semiconductor devices on a high-purity substrate called a "wafer". The number of chips to be manufactured on a wafer of a few inches reaches several thousand pieces, and they are divided into individual circuit units before packaging. [0003] Currently, the wafer dicing methods available on the market are mainly mechanical dicing with saw blades and laser dicing. Traditional mechanical cutting methods such as diamond knife...

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Problems solved by technology

[0004] In view of the shortcomings of the above-mentioned technologies, the present invention provides a cutting method for semiconductor elements to solve other problems such as the adhesive film sticking back to the semiconductor elements easily caused by the existing cutting technology during the cutting process, and the crystal grains fall off or remain during the film pouring process.

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