Manufacturing method of metal mask plates for evaporation

Abstract

The invention provides a new manufacturing method of metal mask plates for evaporation, namely a method for dispersing current during electroform thickening of the metal mask plates. Through manufacturing of auxiliary plating layers on masks between mask plate opening pattern areas and welding fixed areas, excessive-centralized current on the edges of shielding areas in the electroform process isdispersed, so that the formation of electroform tumors in mask areas during thickening of the mask plates can be prevented, the mask plates with smooth surfaces are finally obtained, the welding is convenient, and the service life of the mask plates is prolonged.

Description

technical field [0001] The invention belongs to the display panel industry, and relates to a mask plate used in the production process of an OLED display panel, in particular to a method for manufacturing a metal mask plate for evaporation. Background technique [0002] The metal mask used for vapor deposition of organic light-emitting materials in OLED panels cannot produce openings with large cone angles due to the limitation of process conditions during the production process. The large cone angle is the key to ensure that the organic light-emitting material is evenly vapor-deposited on the glass substrate. Therefore, in order to minimize the shadow effect produced by the organic material during the evaporation process, it is necessary to make the mask as thin as possible, but the thinner mask is easily loosened or damaged after welding to the frame, and the position accuracy of the opening cannot be guaranteed. Therefore, it is necessary to thicken the mask plate welded...

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Problems solved by technology

Therefore, in order to minimize the shadow effect produced by the organic material during the evaporation process, it is necessary to make the mask as thin as possible, but the thinner mask is easily loosened or damaged after welding to the frame, and the position accuracy of the opening cannot be guaranteed. Therefore, it is necessary to thicken the mask plate welded to the frame part

like figure 1 The metal mask plate 1 shown includes an opening pattern area 10, a mask area 11 and a soldering fixed area 12. When thickening the soldering fixed area 12, in order to prevent the thickness of the opening pattern area 10 from being affected, the opening pattern area is selected 10 is shielded, when the area of ​​the shielding area 13 is larger than the area of ​​the opening pattern area 10 and smaller than the area of ​​the masking area 11, when the secondary electroforming is thickened, the current density originally dispersed in the opening pattern area 10 will be concentrated in the shielding area 13, an excessive current density will form electroformed buildup on the outer edge of the shielded area 13, that is, the electroformed coating grown on the outer edge of the shielded area 13 will be too thick, and gradually become larger in the direction of the welding fixed area 12. This situation will cause the unevenness of the final mask area 11, and the unevenness of the mask area 11 will seriously affect the overall evaporation quality and precision of the mask, and at the same time cause the mask to not be flat and tightly attached to the frame during welding joint, forming a virtual soldering, which makes the mask very easy to loosen during use, which greatly reduces the service life of the mask

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