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Device testing with heat pipe cooling assembly

A technology of cooling devices and heat pipes, applied in measuring devices, electronic circuit testing, environmental/reliability testing, etc., can solve problems such as cost disparity, and achieve the effect of eliminating demand

Pending Publication Date: 2019-04-16
ADVANTEST CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The cost of these cooling mechanisms varies widely

Method used

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  • Device testing with heat pipe cooling assembly
  • Device testing with heat pipe cooling assembly
  • Device testing with heat pipe cooling assembly

Examples

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Embodiment Construction

[0019] Reference will now be made in detail to the embodiments, examples of which are illustrated in the accompanying drawings. While the invention will be described in conjunction with these embodiments, it will be understood that they are not intended to limit the invention to these embodiments. On the contrary, the invention is intended to cover alternatives, modifications and equivalents, which may be included within the spirit and scope of the invention as defined by the appended claims. Furthermore, in the following detailed description, numerous specific details are set forth in order to provide a thorough understanding. However, one of ordinary skill in the art will recognize that the embodiments may be practiced without these specific details.

[0020] A new cooling assembly suitable for use in testing of devices is disclosed. The new cooling assembly transfers heat from the area next to, near and / or surrounding the DUT (device under test) being received to a target...

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PUM

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Abstract

The invention relates to device testing with a heat pipe cooling assembly. New cooling assembly suitable for use in the testing of devices is disclosed. The new cooling assembly transfers heat that isin close proximity to, within vicinity of, and / or in surrounding area adjacent to a DUT (device under test) undergoing testing to a target location that is away from the DUT. Consequently, the DUT iscooled. By employing heat pipes coupled to plates in contact with the DUT, the new cooling assembly augments cooling capacity at the DUT's location and surrounding area. Yet, the use of an ambient air flow generated by a fan is sufficient to manage and dissipate the heat transferred to the target location. Also, the new cooling assembly is readily installable in DUT testing equipment because itsdesign is quite flexible to adapt to various requirements and space constraints of DUT testing equipment for different DUT footprints or form factors.

Description

technical field [0001] Embodiments of the invention relate to testing of devices. More particularly, embodiments relate to cooling assemblies and apparatus suitable for use in testing of devices (eg, electronic devices). Background technique [0002] Environmental test chambers are commonly used in the testing of electronic devices. Environmental testing chambers provide controlled environmental conditions by utilizing various mechanisms for cooling and / or heating the air inside the environmental testing chamber. However, certain types of electronic devices do not need to be tested in the tightly controlled environmental conditions provided by environmental test chambers. Typically, the DUT (device under test) is placed inside the environmental test chamber, while the test equipment is located outside the environmental test chamber. This leads to the problem of not being able to manipulate the DUT during testing because the DUT is in the environmental test chamber and thu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/00G01R31/28G01R1/44F28D15/02F28D15/04
CPCF28D15/02F28D15/04G01R1/44G01R31/003G01R31/2849H01L23/3672G01R31/2877F28D15/0266F28D15/0275H05K7/20336H01L23/427F28D15/0233G01R31/2874H05K7/20836H05K7/20418H05K7/20736
Inventor 罗兰·沃尔夫
Owner ADVANTEST CORP