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Functional film embedded structure and forming process thereof

A molding process and functional film technology, which is applied to electrical components, casings/cabinets/drawer parts, sealed casings, etc., can solve the problem of increasing air humidity of electronic components, unreasonable device design, and the impact of electronic components, etc. question

Pending Publication Date: 2019-04-16
DONGGUAN JIAN XIONG IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Electronic components will generate a lot of heat during work, which will evaporate water, increase the humidity of the air around electronic components, and adversely affect the normal operation of electronic components
In the prior art, the design of the device for storing electronic components is unreasonable, and it is impossible to realize ventilation and heat dissipation inside the device, and at the same time prevent external water vapor from entering

Method used

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  • Functional film embedded structure and forming process thereof
  • Functional film embedded structure and forming process thereof
  • Functional film embedded structure and forming process thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] Such as Figure 1-4 As shown, a functional film embedded structure includes a structure 1, a functional film 2, a first through hole 3 and a second through hole 4, the functional film 2 is embedded in the structure 1, and the first through hole 3 is set in the The outer wall of the structure 1, the second through hole 4 is arranged on the inner wall of the structure 1, the first through hole 3 corresponds to the second through hole 4, and the functional film 2 is arranged between the first through hole 3 and the second through hole 4 . The electronic components are arranged in the box or box with this structure in the present invention. When the electronic components are working, because the electronic components have their own resistance, heat will be generated after the current is turned on, and these hot gases pass through the second channel in turn. The hole 4, the functional film 2, and the first through hole 3 are evacuated to the external environment. At the sam...

Embodiment 2

[0046] like Figure 1-4 Shown, a kind of molding process of the functional film embedded structure of embodiment 1 comprises the following steps:

[0047] S1. Prepare the prefabricated part, place the functional film 2 on the supporting ring 5, and complete the preparation of the prefabricated part;

[0048] S2, placing the prefabricated part in the mold, and the protrusions in the mold support and position the support ring 5;

[0049] S3, placing the mold in the injection molding machine;

[0050] S4, start the injection molding machine, inject raw materials into the mold, and complete the injection molding;

[0051] S5, close the injection molding machine, and cool down the mold;

[0052] S6, open the mold, and take out the product with the embedded structure of the functional film;

[0053] Wherein, the order of steps S2 and S3 can be interchanged.

[0054] Preferably, in step S1, the functional film 2 is fixed on the support ring 5 by liquid glue or double-sided adhes...

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Abstract

The invention belongs to the technical field of electronic equipment. The invention relates to a functional film, in particular to a functional film embedded structure. The structure comprises a structural body, a functional film, a first through hole and a second through hole. The functional film is embedded in the structural body, and the first through hole is formed in the outer wall of the structural body. The second through hole is formed in the inner wall of the structural body, and the first through hole is corresponding to the second through hole. The functional film is arranged between the first through hole and the second through hole. Heat is generated after the conduction of a current, so that the air in a closed space is heated to expand. The expansion air sequentially passesthrough the second through hole, the functional film and the first through hole and is evacuated into an external environment. Meanwhile, the moisture or dust in the external environment cannot entera container for storing electronic components under the action of the functional film, thereby slowing down aging of the electronic components and a PCB, and prolonging the service life. In addition,the invention further provides a forming process of the structure so as to improve the production efficiency.

Description

technical field [0001] The invention belongs to the technical field of electronic equipment, and in particular relates to a functional film embedded structure and a molding process thereof. Background technique [0002] With the development of industry, the application of automation and intelligent high-end equipment is becoming more and more common. These devices are composed of a large number of software and hardware, where software refers to computer language programs, and hardware refers to electronic components that execute computer language programs. Usually, there are a large number of electronic components in a device, and these electronic components The service life of the device often determines the service life of the equipment. Generally, the water vapor, dust or light in the natural environment will corrode the circuits of the electronic components, causing accelerated aging of the electronic components and shortening the service life of the electronic componen...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K5/02H05K5/06
CPCH05K5/0213H05K5/068
Inventor 朱建
Owner DONGGUAN JIAN XIONG IND CO LTD
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