Devices for high-speed imaging sensor data transfer

Abstract

The present invention discloses an imaging sensor assembly comprising at least one substrate comprising a plurality of substrate signal lines. The imaging sensor assembly also includes at least one imaging sensor package disposed on the at least one substrate, the at least one imaging sensor package including at least one imaging sensor disposed on the at least one imaging sensor package substrate. The imaging sensor assembly also includes at least one receiver package disposed on the at least one substrate, the receiver package including at least one receiver integrated circuit disposed on the at least one receiver package substrate. The imaging sensor assembly also includes at least one electrical interconnect operably coupled to the at least one imaging sensor package and the at least one receiver package. A plurality of data signals are transmitted between the at least one imaging sensor package and the at least one receiver package via the at least one electrical interconnect.

Description

[0001] Cross References to Related Applications [0002] This application asserts under 35 U.S.C. §119(e) filed August 29, 2016 by Steve Zamek, David L. Brown, and Venkate U.S. Provisional Patent Application No. 62 / 380,742, entitled "METHOD FOR DATATRANSFER FROM A HIGH-SPEED SCANNING SENSOR," in which Venkatraman Iyer is the inventor Rights, said application is incorporated herein by reference in its entirety. technical field [0003] The present invention relates generally to imaging sensors suitable for implementation in semiconductor inspection and metrology systems, and more particularly, to high speed imaging sensor data transfer in semiconductor inspection and metrology systems. Background technique [0004] The demand for improved semiconductor device inspection and metrology systems continues to increase. For example, inspection systems typically include one or more imaging or scanning sensors that are part of an integrated circuit package. The integrated circuit...

AI Technical Summary

Problems solved by technology

Also, the total component count to make a single master PCB is usually lower than for a small modular board array

However, a single master PCB is subject to the additional design constraints of having high-speed data rates, making the fabrication of a single master PCB more difficult and more expensive than a small modular board array

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