Zinc-cooper coating for bone implantation and preparation method thereof
A technology of copper coating and bone implantation, which is applied in medical materials, filling materials for joint replacement and human tissue defects, antibacterial implant materials, and dental implants. It can solve the problems of unsatisfactory adhesion and growth of bone cells. , to achieve the effect of improving immunity, wide application range and good biocompatibility
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Embodiment 1
[0024] Put the porous titanium alloy (Ti-6Al-4V) sample into the furnace body 1 of the deposition chamber; put the copper chloride powder into the furnace body 2 of the evaporation chamber, and put pure zinc into the high temperature zone of the furnace body 1 of the deposition chamber, and the atomic ratio is Zinc: copper chloride = 25:1, then connect the air circuit, check the sealing condition, and draw a limit vacuum (10 -4 Pa), the whole system was repeatedly purged 3 times with argon to ensure that the oxygen content was minimized. Set the deposition temperature to 300°C, the zinc evaporation temperature to 700°C, the copper chloride source evaporation temperature to 200°C, the working vacuum degree to 5Pa, the hydrogen flow rate to 50SCCM, the deposition time to 3h, the thickness of the deposited metal zinc-copper layer to be 200μm, and the mass of copper The percentage is 2%. In order to determine the effect of the coating on promoting osteogenesis, an alkaline phosph...
Embodiment 2
[0026] Put the porous titanium alloy (Ti-6Al-4V) sample into the furnace body 1 of the deposition chamber; put the copper chloride powder into the furnace body 2 of the evaporation chamber, and put pure zinc into the high temperature zone of the furnace body 1 of the deposition chamber, and the atomic ratio is Zinc: copper chloride = 20:1, then connect the air circuit, check the sealing condition, and draw a limit vacuum (10 -4 Pa), the whole system was repeatedly purged 3 times with argon to ensure that the oxygen content was minimized. Set the deposition temperature to 200°C, the zinc evaporation temperature to 600°C, the copper chloride source evaporation temperature to 300°C, the working vacuum to 5Pa, the hydrogen flow to 100SCCM, the deposition time to 2h, the thickness of the deposited metal zinc-copper layer to be 100μm, and the mass of copper The percentage is 5%.
Embodiment 3
[0028] Put the porous titanium alloy (Ti-6Al-4V) sample into the furnace body 1 of the deposition chamber; put the copper chloride powder into the furnace body 2 of the evaporation chamber, and put pure zinc into the high temperature zone of the furnace body 1 of the deposition chamber, and the atomic ratio is Zinc: copper chloride = 15:1, then connect the air circuit, check the sealing condition, and draw a limit vacuum (10 -4 Pa), the whole system was repeatedly purged 3 times with argon to ensure that the oxygen content was minimized. Set the deposition temperature to 150°C, the zinc evaporation temperature to 500°C, the copper chloride source evaporation temperature to 300°C, the working vacuum to 50Pa, the hydrogen flow to 100SCCM, the deposition time to 1.5h, and the thickness of the deposited metal zinc-copper layer to be 150μm, copper The mass percentage is 7%.
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