A kind of high thermal conductivity electronic packaging composite material and preparation method thereof
A technology of electronic packaging and composite materials, which is applied in the direction of nanotechnology, circuits, electrical components, etc. for materials and surface science, can solve the problems of decreased fluidity of packaging materials, reduce thermal expansion coefficient, increase glass transition temperature, and improve Effect of electromigration failure time
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Embodiment 1
[0037] The high thermal conductivity electronic packaging composite material provided by the invention is used on the packaging filling of microelectronic chips, such as figure 1 As shown, the outer surface of the nano-copper particles 1 is covered with a silicon dioxide layer 2; the silicon dioxide layer 2 is used as an insulating layer, and its thickness is 10-100 nm; the particle size of the nano-copper particles is 50-500 nm. The nano-copper particles wrapped with the silicon dioxide layer 2 are mixed with the polymer 3 to form a high thermal conductivity electronic packaging composite material; wherein, the volume ratio of the insulating nano-particles to the polymer is 0.1-0.3. Polymers include epoxy, acrylate or phenolic resins.
[0038] Fill the electronic packaging composite material with high thermal conductivity between the chip 4 and the substrate 5, and also include the micro-bump 6 between the chip 4 and the substrate 5, the micro-bump 6 is the I / O connection bet...
Embodiment 2
[0041] Step 1: Weigh 2mmol copper oxalate and dissolve it in 25ml N,N-dimethylformamide solution;
[0042] Step 2: Add 1mmol polyvinylpolypyrrolidone and 1.3mmol sodium borohydride to the solution in step 1;
[0043] Step 3: After stirring for five minutes, the above mixture was heated to 85°C and kept for 3 minutes, and then filtered to obtain an orange precipitate, which is called filter residue A, and the filter residue A was washed several times with alcohol to obtain intermediate product A;
[0044]Step 4: Dissolving and dispersing the intermediate product A obtained in Step 3 in a mixed solution of 60ml of water and 40ml of ethanol to obtain a mixed solution;
[0045] Step 5: Add 1 mL of concentrated ammonia water to the mixed solution in step 4, and then add 0.24 mmol of ethyl orthosilicate; wherein, the concentration of ammonia water is 28% by mass;
[0046] Step 6: After stirring at room temperature for 6 hours, filter to obtain filter residue B, wash filter residue ...
Embodiment 3
[0054] Step 1: Weigh 3mmol copper oxalate and dissolve it in 50ml N,N-dimethylformamide solution;
[0055] Step 2: Add 1.6mmol polyvinylpolypyrrolidone and 1.8mmol sodium borohydride to the step 1 solution;
[0056] Step 3: After stirring for five minutes, the above mixture was heated to 90°C and kept for 4 minutes, and then filtered to obtain an orange precipitate, which is called filter residue A, and the filter residue A was washed several times with alcohol to obtain intermediate product A;
[0057] Step 4: Dissolving and dispersing the intermediate product A obtained in Step 3 in a mixed solution of 75ml of water and 75ml of ethanol to obtain a mixed solution;
[0058] Step 5: Add 3mL concentrated ammonia water to the mixed solution in step 4, and then add 0.3mmol tetraethyl orthosilicate; wherein, the mass percentage concentration of ammonia water is 26%;
[0059] Step 6: After stirring at room temperature for 7 hours, filter to obtain filter residue B, wash filter resi...
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