Method for grinding sample cross section

Abstract

The invention discloses a method for grinding a sample cross section. The method for grinding the sample cross section comprises the steps that firstly, wafer formed by first semiconductor substrate is provided, and the reverse side of the first semiconductor substrate of wafer is attached to blue film; secondly, sampling is conducted, wherein cutting is conducted in a cutting way on the upper edge of the blue film, thus a sample block is acquired, and the sample block comprises multiple samples for failure analysis; thirdly, the front side of the first semiconductor substrate of the sample block is stuck on cover glass through glue, then first horizontal calibrating and first fixing are conducted, and the blue film is torn off in first fixing process; fourthly, the reverse side of the first semiconductor substrate of the sample block is stuck on the front side of second semiconductor substrate through glue, then second horizontal calibrating and second fixing are conducted; and fifthly, cross section grinding is conducted with the sample block fixed with the cover glass and the second semiconductor substrate as a whole. By means of the method for grinding the sample cross section,grinding difficulty of the sample cross section can be simplified, and grinding of cross sections of minitype samples is achieved.

Description

technical field [0001] The invention relates to a semiconductor integrated circuit manufacturing method, in particular to a sample cross-section grinding method. Background technique [0002] In the field of semiconductor failure analysis, due to the small structure or different materials to be analyzed in the process of silicon wafer production, testing, and product analysis, manual splitting and fixed-point cutting cannot meet the analysis requirements, and samples can only be obtained by cross-section grinding. specific analysis results. [0003] At present, due to the higher integration of analysis samples in the field of semiconductor failure analysis, the smaller the size, it is very difficult to fix, stick, and grind small samples in the process of grinding, and it is impossible to correct the level of micro samples, so it is difficult to get expectations. Effect. Contents of the invention [0004] The technical problem to be solved by the present invention is to ...

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Problems solved by technology

[0003] At present, due to the higher integration of analysis samples in the field of semiconductor failure analysis, the smaller the size, it is very difficult to fix, stick, and grind small samples in the process of grinding, and it is impossible to correct the level of micro samples, so it is difficult to get expectations. Effect

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