Circuit substrate transportation vehicle with dust removal function

A circuit substrate and function technology, applied in printed circuits, printed circuit manufacturing, trolleys, etc., can solve problems such as affecting quality and breakage, and achieve the effects of improving work efficiency, solving deformation, and improving quality stability.

Pending Publication Date: 2019-04-30
广东依顿电子科技股份有限公司
View PDF0 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, in the existing production, the handling work of the circuit board is mainly completed by the handling trolley, but in the actual operation process, most of the circuit boards are stacked and transported, which easily leads to deformation, embossing, Fractures and other adverse conditions affect the quality. At th

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Circuit substrate transportation vehicle with dust removal function
  • Circuit substrate transportation vehicle with dust removal function
  • Circuit substrate transportation vehicle with dust removal function

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0070] The present application will be described in further detail below through specific embodiments in conjunction with the accompanying drawings.

[0071] Such as Figure 1-13 As shown above, the circuit board carrier with dust removal function includes a body 1, a placement chamber 2, a left push mechanism 3, an air blowing dust removal mechanism 10, a receiving mechanism 4, a blowing mechanism 5, a buffer mechanism 6, and a pushing mechanism 7 , Mobile loading platform 8, photoelectric switch group 9.

[0072] Specifically, the placement chamber 2 is provided on the upper side of the body 1 for placing circuit substrates, and a communication slot 21 communicating with the inside of the body 1 is opened on the left side of the bottom. The left pushing mechanism 3 is arranged on the rear side of the placement chamber 2, and its pushing end extends into the placement chamber 2, and is used to push the circuit board to the left so that the circuit board passes through the co...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a circuit substrate transportation vehicle with a dust removal function. The circuit substrate transportation vehicle comprises a machine body, a containing cavity, a leftwardpushing mechanism, a blowing and dust removing mechanism, a receiving mechanism, a blowing-down mechanism, a buffering mechanism, a pushing-out mechanism and a movable carrying platform, wherein the containing cavity is provided a communicating groove opening. According to the circuit substrate transportation vehicle, vertical circuit substrates are pushed towards the left through the leftward pushing mechanism, so that the circuit substrates can fall into the machine body through the communicating groove opening, in the falling process, dust on the circuit substrates is removed through blowing by the blowing and dust removing mechanism, then the circuit substrates falling down are revived through the receiving mechanism, the circuit substrates can be blown to topple towards the right through the blowing-down mechanism later on, meanwhile, the buffering mechanism buffers the circuit substrates which are toppled rightwards so that the circuit substrates can fall down slowly so as to beflatly placed on the receiving mechanism, and then the horizontally-placed circuit substrates are pushed to the movable carrying platform from the circuit substrates on the receiving mechanism throughthe pushing-out mechanism later on, thereby achieving the purpose of automatically removing the dust; and in addition, the vertically-placed circuit substrates can be converted into the horizontallystacked circuit substrates, so that carrying is facilitated.

Description

【Technical field】 [0001] The present application relates to the technical field of circuit substrate dust removal, and in particular relates to a circuit substrate carrier with dust removal function. 【Background technique】 [0002] PCB (Printed Circuit Board), the Chinese name is printed circuit board, also known as printed circuit board, is an important electronic component, a support for electronic components, and a provider of circuit connections for electronic components. [0003] However, in the existing production, the handling work of the circuit board is mainly completed by the handling trolley, but in the actual operation process, most of the circuit boards are stacked and transported, which easily leads to deformation, embossing, Fractures and other adverse conditions affect the quality. At the same time, the circuit substrates after the process of gong boards, surface-treated inspection boards and other processes often have some dust, dust and other pollutants. Fo...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): B08B5/02B08B13/00H05K3/00B62B3/00B62B5/00
CPCH05K3/0055B62B3/00B62B5/00B62B5/0006B08B5/023B08B13/00
Inventor 莫介云
Owner 广东依顿电子科技股份有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products