Wafer turnover device and wafer turnover method

Abstract

The invention discloses a wafer turnover device and a wafer turnover method. The wafer turnover device comprises a wafer box carrying table, a wafer disc carrying table, a first transfer table, a second transfer table, three carrying mechanisms and a control unit. The first transfer table comprises a wafer edge finder for identifying and adjusting the flat edge position of a wafer; and the secondtransfer table comprises a wafer disc edge finder for identifying and adjusting the flat edge position of a bearing part of a wafer disc. The control unit controls the three carrying mechanisms to transfer wafers between the wafer box carrying table and the wafer edge finder, between the wafer edge finder and the wafer disc edge finder and between the wafer disc edge finder and the wafer disc carrying table, so that the wafers can be efficiently carried from the wafer box carrying table to the wafer disc carrying table or from the wafer disc carrying table to the wafer box carrying table.

Description

technical field [0001] The invention relates to the technical field of semiconductor wafer manufacturing, in particular to a wafer turnover device and a wafer turnover method. Background technique [0002] In the production of the semiconductor industry, wafers use different production processes in the manufacturing process, and the wafer carriers used in the production equipment of different production processes are different. Therefore, the wafers need to be frequently placed between different carriers throughout the process. turnover. For example, between the two production processes of PVD (Physical Vapor Deposition) and MOCVD (Metal Organic Chemical Vapor Deposition), it is necessary to transport the wafer from the raw material warehouse of the semiconductor epitaxy section to the PVD chamber, and to transport the wafer from the PVD chamber to the MOCVD chamber. If the wafer handling cannot be reasonably scheduled, it is easy to cause waste of time and low manufacturi...

AI Technical Summary

Problems solved by technology

If the wafer handling cannot be properly scheduled, it will easily lead to waste of time and low manufacturing efficiency.

[0003]In addition, the wafer is divided into front and back, and the front of the wafer must not be touched. The back of the wafer in the tray is placed on the carrier tray of the next process, which is labor-intensive and very inefficient

When placing the wafer, since the wafer has a flat edge in the circumferential direction, there are requirements for the placement direction of the flat edge when placing the wafer on different carriers, resulting in low efficiency when placing the wafer manually

Further, manual turnover of wafers still poses the risk of wafer particle contamination

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