Chip packaging structure of integrated passive element

Abstract

The invention relates to a chip packaging structure of an integrated passive element. The packaging structure comprises a lead frame, a chip, a passive element and a plastic packaging material used for packaging the lead frame, the chip and the passive element. The lead frame comprises a base island and pins. The passive element is arranged on the base island. The chip is arranged on the passive element. The chip is connected with the pins of the lead frame through gold wires. According to the invention, a stack packaging design is adopted to realize the system module packaging of the base island of the lead frame. The passive element and the chip are sequentially connected to the base island of the lead frame. The small-size packaging of the base island of the lead frame can be realized.The problem of reliability caused by the insufficient filling of the base island of a flexible printed circuit board can be solved. Meanwhile, the production efficiency of products is improved. The utilization rate of the lead frame and the plastic packaging material is improved. In addition, the pins and the base island of the lead frame are used for connecting the chip and the passive element, so that the impedance of a packaging module is reduced. The problem of signal transmission interference is avoided.

Description

technical field [0001] The invention relates to the technical field of chip packaging, in particular to a chip packaging structure integrating passive components. Background technique [0002] In the prior art, most of leadframe-based island QFN package products are only chip packages, without integrating passive components and chips together for packaging, and a few products that integrate passive components and chips together adopt planar packaging, resulting in product The size will be greatly increased, and it is difficult to meet the requirements of small-size packages. Therefore, the packages where passive components and chips are integrated are basically realized by flexible printed circuit boards, but this type of package has very little space at the bottom of the passive components (< 50um), the plastic encapsulation process will cause insufficient filling of the bottom of the passive components, resulting in product reliability problems. Contents of the invent...

AI Technical Summary

Problems solved by technology

[0002] In the prior art, most of leadframe-based island QFN package products are only chip packages, without integrating passive components and chips together for packaging, and a few products that integrate passive components and chips together adopt planar packaging, resulting in product The size will be greatly increased, and it is difficult to meet the requirements of small-size packages. Therefore, the packages where passive components and chips are integrated are basically realized by flexible printed circuit boards, but this type of package has very little space at the bottom of the passive components (< 50um), the plastic packaging process will cause insufficient filling of the bottom of the passive components, resulting in product reliability problems

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