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High-reliability absolute pressure sensor and packaging method

A technology of pressure sensor and packaging method, which is applied in the direction of measuring fluid pressure, instruments, measuring devices, etc., can solve the problems of poor reliability and high cost of back absolute pressure sensor, achieve low cost, improve long-term reliability, and reduce quantity.

Pending Publication Date: 2022-06-21
无锡胜脉电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] In order to solve the problem of poor long-term reliability of conventional package absolute pressure sensors and high cost of back absolute pressure sensors, the present invention provides a MEMS absolute pressure sensor. The sensor includes: a plastic shell, a lead frame, an ASIC chip, a MEMS Chips, metal wires, soft glue, plastic cover;

Method used

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  • High-reliability absolute pressure sensor and packaging method
  • High-reliability absolute pressure sensor and packaging method

Examples

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Embodiment 1

[0041] This embodiment provides a MEMS absolute pressure sensor, including: a plastic casing, a lead frame, an ASIC chip, a MEMS chip, and a metal wire;

[0042] The top of the plastic casing is open, and the lead frame is made of copper alloy, which can be copper-iron alloy, copper-nickel-silicon alloy, copper-chromium-zirconium alloy, and runs through the plastic casing; one end of the lead frame is used as an input / output terminal to connect with the outside world, and the other end Attached to the bottom and side walls of the plastic package to achieve electrical connection with MEMS and ASIC chips.

[0043] The ASIC chip faces down and is glued to the inside of the plastic casing by epoxy resin, and the contact points of the front circuit bumps are in contact with the lead frame to achieve electrical connection;

[0044] The MEMS chip is pasted on the back of the ASIC chip, and is electrically connected to the lead frame by wire bonding through metal wires;

[0045]Each ...

Embodiment 2

[0049] This embodiment provides a packaging method for a MEMS absolute pressure sensor, including the following steps:

[0050] Step 1: Fabrication of plastic enclosure with lead frame;

[0051] The top of the plastic casing is open, and the lead frame is made of copper alloy, which can be copper-iron alloy, copper-nickel-silicon alloy, copper-chromium-zirconium alloy, and runs through the inside and outside of the plastic casing; one end of the lead frame outside the plastic casing serves as an input / output terminal and the outside world. connected, and one end inside the plastic package is closely attached to the bottom and sidewall of the plastic package.

[0052] Step 2: Mount the ASIC chip:

[0053] The ASIC chip faces down and is pasted inside the plastic casing through epoxy resin glue. At the same time, the contact points of the circuit bumps on the front side of the ASIC chip are in contact with the corresponding positions on the lead frame to realize the ASIC chip. ...

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Abstract

The invention discloses a high-reliability absolute pressure sensor and a packaging method, and belongs to the field of sensitive elements and sensors. The sensor comprises a plastic shell, a lead frame, an ASIC (Application Specific Integrated Circuit) chip, an MEMS (Micro Electro Mechanical System) chip, a metal wire, flexible glue and a plastic upper cover. According to the invention, the ASIC chip is assembled on the lead frame in an inverted manner, so that lead bonding of the ASIC chip is avoided, and the total number of metal wires is reduced; secondly, the MEMS chip is assembled above the ASIC chip, so that the packaging space is saved, the packaging density is improved, and small-size packaging is realized; and finally, each input / output terminal on the MEMS chip is connected with the lead frame by adopting two or more metal wires, so that the problems of poor long-term reliability, low finished product yield, high preparation cost and the like of the conventional packaged absolute pressure sensor at present are solved, and the MEMS pressure sensor is more suitable for industrial mass production.

Description

technical field [0001] The invention relates to a high-reliability absolute pressure sensor and a packaging method, belonging to the field of sensitive elements and sensors. Background technique [0002] Pressure sensor is a device that can convert external pressure load into electrical signal output. Among them, the MEMS pressure sensor is prepared based on the micro-electromechanical system (MEMS, Microelectro Mechanical Systems) process. It has the advantages of low cost, small size, high precision and high reliability. It has been widely used in industrial control, automotive, consumer Electronics, Internet of Things and other industries. [0003] According to the pressure reference type of MEMS pressure sensor, it can be further subdivided into absolute pressure, gauge pressure, differential pressure pressure sensor. Among them, the absolute pressure sensor measures the absolute pressure relative to the vacuum; the gauge pressure sensor, the pressure reference is the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01L19/00G01L19/06G01L19/14
CPCG01L19/00G01L19/0061G01L19/0084G01L19/06G01L19/148
Inventor 毕勤刘晓宇
Owner 无锡胜脉电子有限公司
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