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202results about How to "Save packing space" patented technology

Chip packaging structure for slowing down electromagnetic interference and packaging method

The invention discloses a chip packaging structure for slowing down electromagnetic interference and a packaging method thereof. The packaging method comprises the following steps: producing a sinking groove in a silicon substrate, and embedding a chip whose front surface is upwards arranged and provided with welding pads into the sinking groove to save the packaging space; and forming horizontally-arranged or vertically-arranged inductance distribution wires on the front surface of the chip and a first surface of the silicon substrate, forming horizontally-arranged or vertically-arranged capacitance distribution wires on a first insulation layer, and extending a first metal redistribution wire or a second metal redistribution wire and solder balls to the surface of the silicon substrate to ensure that the welding pads of the chip are electrically fanned out of the surface of the silicon substrate and purposes of improving the packaging reliability and achieving simple process and low cost can be achieved. The horizontally-arranged or vertically-arranged inductance distribution wires form an inductor, and the horizontally-arranged or vertically-arranged capacitance distribution wires and dielectric layers among the capacitance distribution wires form a capacitor; and by adopting the inductor and capacitor with filter characteristics, the signal crosstalk among circuits in the chip can be reduced, unnecessary electric signals can be removed by filtration, the reliability and performance of packaged products can be enhanced, and the cost can also be reduced.
Owner:HUATIAN TECH KUNSHAN ELECTRONICS

Method for refreshing water-detacted live portunus tritubercularus

The invention discloses a method for refreshing water-detacted live portunus tritubercularus, which comprises the steps of: 1, purifying the portunus tritubercularus in seawater, and then putting the portunus tritubercularus in the 2-5 DEG C seawater for soaking for 3-5min to ensure that the portunus tritubercularus is in a narcosis state, wherein the 2-5 DEG C seawater contains 0.1 percent of stable vitamin C; 2, putting a moisturizing material in the 2-5 DEG C seawater containing 0.1 percent of stable vitamin C for soaking until the moisturizing material is saturated; and 3, firstly placingan oxygenating agent in a cavity in the middle of a package box, then laying one layer of moisturizing material above the oxygenating agent, placing the portunus tritubercularus above the moisturizing material, placing one layer of moisturizing material, i.e. a second layer of moisturizing material, above the portunus tritubercularus and covering the packaging box by the cover thereof. The methoddisclosed by the invention has the advantages of long survival time of the portunus tritubercularus, capability of effectively ensuring the edible value and enlarging the marketing range, clean surface of the portunus tritubercularus body, and low cost.
Owner:伊焱垚

LED (light emitting diode) packaging structure and preparation method thereof

The invention discloses an LED (light emitting diode) packaging structure. An LED device module structure is adopted for the LED packaging structure, so each LED chip unit does not need to be scribed independently, the process can be saved and the manufacturing cost can be reduced; the LED module is of a vertical electrode structure which can be directly packaged, thus the overall performance of the LED can be improved; as the connection between the LED chips of each LED module is in series-parallel connection, so the LED module can be conveniently applied to the high-power illumination field. The invention also discloses a preparation method for an LED packaging structure. By using the method, an LED module, an LED driving circuit and an ESD (Electronic Static Discharge) protection circuit can be directly fixed on a COB (chip on board) bonding plate substrate, thus the overall performance of the LED can be improved; and each LED chip unit does not need to be scribed independently, thus the process can be saved and the manufacturing cost can be reduced; as the connection between the LED chips of each LED module is in series-parallel connection, so the LED module can be conveniently applied to the high-power illumination field.
Owner:ENRAYTEK OPTOELECTRONICS

Electric lifting media wall

The invention discloses an electric lifting media wall which comprises a base, a lifting assembly, a supporting frame and a wall cover body. The lifting assembly comprises at least one group of lifting stand columns and a driving mechanism for driving the lifting stand columns to ascend or descend; the lower ends of the lifting stand columns are connected with the base; the supporting frame is used for being connected with a display mounting frame, is connected onto the lifting stand columns, and ascends or descends synchronously along with the lifting stand columns; the wall cover body coversa table leg component and the outer side of the supporting frame; the wall cover body is connected with the lifting stand columns or the supporting frame, and ascends or descends synchronously alongwith the lifting stand columns; the outer surfaces of two opposite side plates of the wall cover body are of plane structures; and at least one group of connecting holes are formed in at least one outer side surface, and are used for allowing connecting pieces connected with the display mounting frame to penetrate through the wall cover body from outside to inside and be connected with the supporting frame in the wall cover body. The electric lifting media wall has the advantages that the height can be adjusted, the bearing capacity is strong, the function is diversified, the assembly and thedisassembly are convenient, the later maintenance is facilitated, and the packing size is small.
Owner:美国乐歌有限公司
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