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Photoelectric chip assembly and packaging method

A photoelectric chip and packaging method technology, applied in the electronic field, can solve the problems of high packaging cost, photoelectric chip corrosion and high temperature damage, large chip size, etc., and achieve the effects of simplifying operation, avoiding corrosion and high temperature damage, and simplifying the packaging process

Active Publication Date: 2012-07-11
HISENSE BROADBAND MULTIMEDIA TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The embodiment of the present invention provides a photoelectric chip assembly and a packaging method to solve the problem that the traditional chip packaging method uses sealant packaging to easily cause corrosion and high temperature damage to the photoelectric chip, and the packaging cost is high when packaging with special packaging equipment. The problem of large chip size

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  • Photoelectric chip assembly and packaging method
  • Photoelectric chip assembly and packaging method

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Embodiment 1

[0028] This embodiment provides an optoelectronic chip assembly, see figure 1 As shown, the figure shows the overall packaging effect of the optoelectronic chip assembly.

[0029] The optoelectronic chip assembly in this embodiment includes: a circuit board 1 with a cavity, a bottom plate 6 located below the cavity and fixed on the bottom of the circuit board 1, an optical fiber fixed on the bottom plate 6 through a first carrier 5 Component 7, the first optoelectronic chip 3 fixed on the base plate 6 through the second carrier 4, and the circuit board 1 with a cavity and the base plate 6 located above the first optoelectronic chip 3 and the optical fiber assembly 7 The cover of the closed space 8.

[0030] Wherein, the shape of circuit board 1 refers to figure 2 and image 3 as shown, figure 2 A top view of the circuit board 1 in the optoelectronic chip assembly is given, image 3 A side view of the circuit board 1 in the optoelectronic chip module is given. The circu...

Embodiment 2

[0039] The embodiment of the present invention provides a packaging method for optoelectronic chip components, such as Figure 6 shown, including the following steps:

[0040] S501: Fix the first optoelectronic chip and the optical fiber assembly on the circuit board, and electrically connect the first optoelectronic chip to the circuit board, wherein the light receiving surface of the first optoelectronic chip is connected to the optical fiber assembly The luminous surface is opposite;

[0041] S502: Fix the cover on the circuit board, wherein the cover is located above the optoelectronic chip and the optical fiber assembly, and forms a closed space with the circuit board.

[0042] Preferably, the step of fixing the first optoelectronic chip and the optical fiber assembly on the circuit board specifically includes: affixing and fixing the first carrier on the circuit board, and fixing the optical fiber assembly on the first carrier affixing and fixing the second carrier on ...

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Abstract

The invention provides a photoelectric chip assembly and a packaging method. The photoelectric chip assembly comprises a first photoelectric chip, an optical fiber assembly, a circuit board and a sealing cap. The first photoelectric chip and the optical fiber assembly are fixed on the circuit board. A light receiving surface of the first photoelectric chip is opposite to a light emitting surface of the optical fiber assembly. The first photoelectric chip is connected electrically with the circuit board. The sealing cap is located above the first photoelectric chip and the optical fiber assembly and forms a sealed space with the circuit board. The chip is packaged by a packaging structure in the photoelectric chip assembly so as to avoid corrosion and high temperature damage caused by a sealant to the photoelectric chip, reduce the packaging volume and simplify the flow of packaging operation.

Description

technical field [0001] The invention relates to the field of electronic technology, in particular to a photoelectric chip component and a packaging method. Background technique [0002] At present, there are generally two chip packaging methods commonly used. One is to use a plastic sealing process to cover the chip with a sealant and complete the curing. However, in this way, since the sealant is in direct contact with the chip, there is a serious risk of stress damage to the chip. At the same time, a chemical reaction between the sealant itself and the chip is prone to occur, thereby causing corrosion to the chip and resulting in low packaging reliability. Moreover, since a very high temperature is required when the sealant is poured and covered, the high temperature when the sealant is used to package the optoelectronic chip is likely to damage the optoelectronic chip. The second is to use a ceramic or metal shell to package the chip separately. The welding or brazing p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L31/0203H01L31/02H01L31/18
CPCY02P70/50
Inventor 姜瑜斐张海祥
Owner HISENSE BROADBAND MULTIMEDIA TECH
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