LED (light emitting diode) packaging structure and preparation method thereof

Abstract

The invention discloses an LED (light emitting diode) packaging structure. An LED device module structure is adopted for the LED packaging structure, so each LED chip unit does not need to be scribed independently, the process can be saved and the manufacturing cost can be reduced; the LED module is of a vertical electrode structure which can be directly packaged, thus the overall performance of the LED can be improved; as the connection between the LED chips of each LED module is in series-parallel connection, so the LED module can be conveniently applied to the high-power illumination field. The invention also discloses a preparation method for an LED packaging structure. By using the method, an LED module, an LED driving circuit and an ESD (Electronic Static Discharge) protection circuit can be directly fixed on a COB (chip on board) bonding plate substrate, thus the overall performance of the LED can be improved; and each LED chip unit does not need to be scribed independently, thus the process can be saved and the manufacturing cost can be reduced; as the connection between the LED chips of each LED module is in series-parallel connection, so the LED module can be conveniently applied to the high-power illumination field.

Description

technical field [0001] The invention relates to the technical field of LED preparation, in particular to an LED packaging structure and a preparation method thereof. Background technique [0002] A light-emitting diode (LED, Light Emitting Diode) is a semiconductor solid-state light-emitting device, which uses a semiconductor PN junction as a light-emitting material, and can directly convert electricity into light. When a forward voltage is applied to both ends of the semiconductor PN junction, the minority carriers injected into the PN junction recombine with the majority carriers, releasing excess energy to cause photon emission, and the direct emission colors are red, orange, yellow, Green, blue, blue, purple light. [0003] In 1998, Lumileds packaged the world's first high-power LED (1WLUXOEN type device), which made LED devices change from the previous application of indicator lights to a new type of solid light source that can replace traditional lighting, triggering ...

AI Technical Summary

Problems solved by technology

In the current LED chip packaging process, the LED chips must first be diced into individual chip units (die), and then the individual chip units are packaged and connected in series and parallel, which makes the process steps particularly cumbersome. Manufacturing efficiency is lower and manufacturing cost is increased

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