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Wafer-level preparation method of photosensitive module and structure of lens module

A photosensitive module and wafer-level technology, applied in radiation control devices, color TV components, TV system components, etc., can solve problems such as long process time, high cleanliness requirements, and low packaging costs

Active Publication Date: 2021-09-14
NINGBO SEMICON INT CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The packaging cost of COB is relatively low, and the height in the Z direction (vertical height) is low. The disadvantages are high requirements for cleanliness, the need to improve the process to improve yield, high cost of process equipment, and long process time

Method used

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  • Wafer-level preparation method of photosensitive module and structure of lens module
  • Wafer-level preparation method of photosensitive module and structure of lens module
  • Wafer-level preparation method of photosensitive module and structure of lens module

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Embodiment approach

[0043] like figure 1 As shown, according to an embodiment of the present invention, a wafer-level manufacturing method of a photosensitive module is provided, comprising the following steps:

[0044] Step 1: As shown in FIG. 2(A), provide a first wafer 1 formed with a plurality of photosensitive elements 2, and a photosensitive area is provided on the photosensitive element 2, which can be formed on the first wafer 1 in a variety of known ways. The photosensitive element 2 is formed.

[0045] As an example, the photosensitive element 2 is a CCD (Charge Coupled) element or a CMOS (Complementary Metal Oxide Semiconductor) device.

[0046] Step 2: as shown in FIG. 2(B), temporarily bond the second carrier substrate 3 on the front side of the first wafer 1; and thin the back side of the first wafer 1, as shown in FIG. 2(C). Show.

[0047] The thinning process can use any suitable mechanical grinding process, chemical mechanical grinding process or etching process. The thicknes...

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Abstract

A wafer-level preparation method of a photosensitive module and a lens module structure, the method comprising the following steps: providing a first wafer formed with a plurality of photosensitive elements; forming a through hole on the back of the first wafer to expose the photosensitive element Electrical connection part; fill conductive material in the through hole to form a conductive plug, and electrically communicate with the electrical connection part; form a conductive bump on the conductive plug; bond a filter on the photosensitive element; replace the existing filter The chip is installed on the COB lens group support frame above the photosensitive element to reduce the vertical dimension of the lens module in the Z direction; a through hole is formed on the back of the first wafer to expose the electrical connection part of the photosensitive element, and the conductive part is filled in the through hole materials, form conductive plugs, lead the circuit from the through holes of the first wafer, and form conductive bumps on the conductive plugs, avoiding the wire bonding process in the COB lens group, thereby reducing the size of the lens module in the horizontal XY direction size, saving space.

Description

technical field [0001] The invention relates to the technical field of semiconductors, and more specifically, to a wafer-level preparation method of a photosensitive module and a lens module structure. Background technique [0002] There are two types of packaging for image modules: COB (Chip On Board) and CSP (Chip Scale Package). The packaging cost of COB is relatively low, and the height in the Z direction (vertical height) is low. The disadvantages are that it has high requirements for cleanliness, needs to improve the process to improve yield, high cost of process equipment, and long process time. [0003] With the advantages of better image quality and lower module height, the COB process has been gradually adopted by high-end mobile phone lens module manufacturers, and has become the mainstream process for the development of mobile phone camera module process technology. [0004] Affected by the thin and light design trend of mobile phones, the size of the existing C...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/146H04N5/225
CPCH01L27/14621H01L27/14636H01L27/14685H01L27/14687H04N23/54H04N23/55
Inventor 陈达
Owner NINGBO SEMICON INT CORP
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