An Antistatic Circuit Packaging Structure with Pin Tip Discharge

Abstract

The invention discloses an antistatic circuit encapsulation structure with pin tip discharge. The structure comprises an electrostatic cover, a resistance board, a connecting bolt, reinforcing pins, IC outer legs and an encapsulation block. The electrostatic cover is horizontally mounted on the resistance board and is in close contact with a contact surface, and the connecting bolt vertically passes the center of the resistance board and engages with a thread of a metal block at the top of the encapsulation block. More than two IC outer legs are installed in an array around the encapsulation block, and the reinforcing pins are soldered and fixed on four diagonal bottoms of the electrostatic cover. In summary, according to improvement in the invention, the encapsulation block can change theshape of a conductive board in working and shutdown states through the thermal deformation characteristics of a memory metal, an internal circuit in the encapsulation block is effectively protected from being broken by static electricity, and at the same time, the heat dissipation effect is good.

Description

technical field [0001] The invention relates to a circuit package structure, in particular, an antistatic circuit package structure with pin tip discharge. Background technique [0002] Circuit packaging is to integrate tiny circuits and form a control circuit with many functions on the PCB layer welded by external pins. Because the packaging is highly integrated, it can make the circuit more modular, so it is widely used in high-tech industries. , but the packaged circuit is susceptible to static electricity: [0003] Static electricity can reach thousands of volts. Due to the SOP packaging method of packaging circuits, in order to ensure the stability of signal feedback, the pins are short and dense. In a dry environment, the components absorb dust and change the impedance between the lines, affecting the function and function of the components. Life expectancy, and static electricity directly conducts conductive breakdown to multiple pins, and in order to avoid the influ...

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Problems solved by technology

[0002] Circuit packaging is to integrate tiny circuits and form a control circuit with many functions on the PCB layer welded by external pins. Because the packaging is highly integrated, it can make the circuit more modular, so it is widely used in high-tech industries. , but the packaged circuit is susceptible to static electricity:

[0003] Static electricity can reach thousands of volts. Due to the SOP packaging method of packaging circuits, in order to ensure the stability of signal feedback, the pins are short and dense. In a dry environment, the components absorb dust and change the impedance between the lines, affecting the function and function of the components. Life expectancy, and static electricity directly conducts conductive breakdown to multiple pins, and in order to avoid the influence of static electricity on the packaged chip, it is covered with a metal cover, and the heat dissipation is affected to some extent. The chip is easy to cause desoldering

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