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Packaging film, preparation method thereof, display panel and preparation method thereof

A technology for encapsulating films and display panels, applied in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., can solve the problems of easy disconnection of glass encapsulation films and deterioration of encapsulation film performance, so as to achieve difficult disconnection and avoid performance. The effect of deterioration and corrosion prevention

Active Publication Date: 2019-05-03
YUNGU GUAN TECH CO LTD
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Problems solved by technology

[0003] Based on this, it is necessary to provide an encapsulation film and its preparation method, and a display panel for the problem that the glass encapsulation film is easily broken during the bending process, forming new water molecule erosion channels, and causing the performance of the encapsulation film to deteriorate.

Method used

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  • Packaging film, preparation method thereof, display panel and preparation method thereof
  • Packaging film, preparation method thereof, display panel and preparation method thereof
  • Packaging film, preparation method thereof, display panel and preparation method thereof

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Embodiment Construction

[0040] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0041] As mentioned in the background technology, the glass packaging film in the prior art is easy to break during the bending process, forming new water molecule erosion channels, resulting in the deterioration of the performance of the packaging film. The inventors found that such a The reason for the problem is that the toughness and water blocking properties of the organic layer in the encapsulation film are relatively poor. The multi-layer thin film pack...

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Abstract

The invention relates to a packaging film, a preparation method thereof, a display panel and a preparation method thereof. The packaging film includes a first inorganic layer, an organic layer, and asecond inorganic layer which are laminated. The organic layer includes an organic matrix and moisture absorbent particles. The particle sizes of the moisture absorbent particles are in a gradient distribution in a direction toward the second inorganic layer along the first inorganic layer. The organic layer has the moisture absorbent particles are in the gradient distribution in a direction towardthe second inorganic layer along the first inorganic layer, and the toughness and water blocking property of the organic layer can be fully improved. The packaging film provided by the invention canbe applied in a packaging film of a flexible OLED display. The packaging film is not easily broken during a bending process, the erosion of water molecules can be well prevented, and the deteriorationof the performance of the packaging film is avoided.

Description

technical field [0001] The present application relates to the field of screen display technology, in particular to an encapsulation film and a preparation method thereof, a display panel and a preparation method thereof. Background technique [0002] Existing packaging films are generally packaged with glass. However, the glass packaging film is easily broken during the bending process, forming new water molecule erosion channels, resulting in deterioration of the performance of the packaging film. Contents of the invention [0003] Based on this, it is necessary to provide an encapsulation film, a preparation method thereof, and a display panel for the problem that the glass encapsulation film is easily broken during the bending process, forming new water molecule erosion channels, and causing deterioration in the performance of the encapsulation film. [0004] An encapsulation film, comprising a first inorganic layer, an organic layer and a second inorganic layer stacke...

Claims

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Application Information

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IPC IPC(8): H01L51/52H01L51/56
Inventor 宋平
Owner YUNGU GUAN TECH CO LTD
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