Imaging unit for endoscope, and endoscope
A technology of camera components and endoscopes, applied in the field of endoscopes, can solve the problems of low reliability, damage to component laminates, low resistance, etc., and achieve the effect of high reliability
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Deformed example 1
[0062] like Figure 7 and Figure 8 As shown, in the imaging module 1A of Modification 1, the thicknesses D1A, D2A on the outer peripheral side of the reinforcement member 30 are larger than the thicknesses D1B, D2B on the central axis side. That is, if Figure 8 As shown, in the imaging unit 40A of the imaging module 1A, the central axis C20 of the element stack 20 is located below the optical axis O (on the central axis side). In addition, the thickness of the reinforcement member 30 is substantially the same in the left-right direction.
[0063] Although not shown here, like the endoscope 9 already described, the optical axis O of the imaging unit 1A of the endoscope 9A is arranged at a position eccentric with respect to the central axis C of the rigid distal end portion 3A. .
[0064] Therefore, the stress applied to the imaging module 1A is greater on the outer peripheral side of the rigid front end portion 3A than on the central axis side. On the other hand, in the ...
Deformed example 2
[0066] like Figure 9 As shown, in the imaging module 1B of Modification 2, a plurality of semiconductor elements 21 to 25 having different sizes are alternately stacked. In other words, the imaging module 1B includes semiconductor elements 21 to 25 of various sizes, and the semiconductor elements 21 to 25 stacked adjacently in the element stack 20B have different sizes.
[0067] That is, in the element stack 20B, the first semiconductor element 21 on the rear end side (root end side) joined to the wiring board 50 has the same size as the first semiconductor element 21 (outer dimension in the direction perpendicular to the optical axis). , dimensions under plan view) a plurality of semiconductor elements 25, 23 and semiconductor elements 22, 24 larger than the first semiconductor element 21 are stacked in the order of semiconductor elements 25, 24, 23, 22, 21 from the front side Together.
[0068] In the imaging module 1B, the outer peripheral parts of the main surfaces (fro...
Deformed example 3
[0071] like Figure 10 and Figure 11 As shown, in the imaging module 1C of Modification 3, notches N are provided on the outer peripheral portions of the largest semiconductor elements 22, 24, and part of the side surfaces 22SS, 24SS, etc. of the largest semiconductor elements 22, 24 are exposed on the outer periphery of the element stack 20C. noodle.
[0072] That is, the largest semiconductor elements 22 and 24 have the same size as the imaging element 10 . Larger planar devices can thus be formed on the semiconductor elements 22 , 24 . Furthermore, since the notch N is present, the reinforcing member 30 of the imaging unit 1C can be formed as an integral structure without being divided by the semiconductor elements 22 and 24 .
[0073] Therefore, although the imaging module 1C includes the large semiconductor elements 22 and 24 having the same size as the imaging element 10 , the strength can be ensured.
[0074] In the imaging module 1C, a plurality of semiconductor e...
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