Display motherboard and its preparation method, display substrate and display device

Abstract

The invention provides a display motherboard and a preparation method thereof, a display substrate and a display device, and relates to the field of display technology, which can prevent ESD discharges from occurring in the wiring lines adjacent to the display substrate area on the display motherboard, and reduce damage caused by ESD defects. Damage, improve product yield. The display motherboard includes a base substrate, and the base substrate includes: a plurality of display substrate regions for forming a plurality of display substrates, and a spacer region between every two adjacent display substrate regions; The wiring on the substrate and the electrostatic balance unit; the part of the wiring is located in the display substrate area and extends to the spacer area; the static electricity balance unit is located in the spacer area, and is used for static electricity accumulated on the wiring lines in two adjacent display substrate areas When the charges have a potential difference, they are electrically connected to the traces extending from two adjacent display substrate regions to the spacer region. Used to show the preparation of the master.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a display motherboard and a preparation method thereof, a display substrate and a display device. Background technique [0002] In the actual mass-production manufacturing process of display devices, a large-sized display motherboard (such as an array substrate motherboard, or Array motherboard) is usually formed first, and then the display motherboard is cut to form a single Displays the substrate. [0003] In order to further improve the utilization rate of the substrate (such as the glass substrate) of the display motherboard, the areas where the display substrates to be formed are located have a very small distance from each other, which makes the wiring, etc. located at the periphery of each area The spacing between conductive structures is smaller. When the electrostatic charge accumulated in the adjacent area has a large potential difference, it is easy to cause the occ...

AI Technical Summary

Problems solved by technology

[0004] ESD discharge (Electro-Static Discharge, that is, electrostatic discharge), the instantaneous high current generated will be transmitted to the electronic devices that are electrically connected to it through the above-mentioned wiring and other structures, such as GOA (Gate Driver on Array, that is, the array substrate row driver) The electronic devices in the area and the electronic devices in the AA (Active Area, that is, the effective display area) area will cause breakdown of the electronic devices in these areas and affect the product yield.

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