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High-frequency resin composition and prepreg, laminate and interlayer insulating film prepared therefrom

A resin composition and high frequency technology, applied in the field of high frequency resin composition, laminates and interlayer insulating films, and prepregs, can solve the problems of high water absorption of materials, reduce the packing density, reduce the dielectric constant, and reduce the dielectric constant. The effect of electric constant reduction

Active Publication Date: 2021-04-27
SHENGYI TECH SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, after the epoxy resin is cured, the material inevitably contains a large number of hydrophilic groups, resulting in a large water absorption rate of the material.

Method used

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  • High-frequency resin composition and prepreg, laminate and interlayer insulating film prepared therefrom
  • High-frequency resin composition and prepreg, laminate and interlayer insulating film prepared therefrom
  • High-frequency resin composition and prepreg, laminate and interlayer insulating film prepared therefrom

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0091]According to the method in the synthesis example, a cage sedamine hydrosiloxane having an amino group was obtained at 60 ° C: carboxyl polyorne ether ketone = 10: 50 of the prepolymer 30g, added to N, N-dimethyl .. The amide is dissolved; after the POSS modified polyaryl ether keto is completely dissolved, 50 g of polyphenylene-containing ether (Sa90, SABIC), 10 g containing phosphate (XZ92741, Dow Chemical), 0.01 g 2-ethyl-4 Methylimidazole, 40 g of spherical silica, a proper amount of butidone solvent, mixed mixed with a mixture of 60% solids content.

[0092]The glue was impregnated and coated on the E glass fiber (2116, a single weight of 104 g / m2), and a semi-solid tablet of 50% of the resin content was obtained in a 135 ° C oven.

[0093]The resulting resin content was 50% semi-solidified sheet, and one metal copper foil was placed in a vacuum hot press. The specific pressurization process is compressed at 1.5 MPa pressure, pressed against 2 hours at 195 ° C.

[0094]The copper...

Embodiment 2

[0096]According to the method in the synthesis example, a cage sedamine oxide having an amino group was obtained at 60 ° C: a prepolymer 30g of phenylcyclo-amphorrocarboxyl polyorbal ether ketone = 10: 80, adding an appropriate amount of N, N-dimethyl. Acetamide dissolves; after the POSS modified polyaryl ether keto prepolymer is completely dissolved, 70 g of polyphenylene-containing ether (Sa90, SABIC), 15G containing phosphate (XZ92741, Dow Chemical), 0.01 g 2-ethyl- 4 Methylimidazole, 40 g of spherical silica, a proper amount of butidone solvent, mixed mixed mixed with a 60% solid content.

[0097]Semi-cured sheet, copper-copper laminate preparation method as in Examples 1.

[0098]The copper laminate properties obtained are shown in Table 1.

Embodiment 3

[0100]According to the method in the synthesis example, a cage sedamine having an epoxy group was obtained at 60 ° C for 120 minutes: carboxy polyedic ether ketone = 10: 40 of the prepolymer 30g, added with an appropriate amount of N, N-dimethyl Acetamide dissolves; after the POSS modified polyaryl ether keto polymers are completely dissolved, 70 g of polyphenylene-containing ether (SA9000, SABIC) 18g containing phosphorus flame retardant (SPV100, Octa chemistry), 0.01 g peroxide 2 Tert-butyl, 40 g of spherical silica, an appropriate amount of butidone solvent, mixed mixed with a mixture of 60% solids content.

[0101]Semi-cured sheet, copper-copper laminate preparation method as in Examples 1.

[0102]The copper laminate properties obtained are shown in Table 1.

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Abstract

The invention discloses a high-frequency resin composition, which comprises: modified polyaryletherketone prepolymer: 10-80 parts; polyphenylene ether: 10-80 parts; flame retardant: 5-80 parts by solid weight 40 parts; Accelerator: 0.001-2 parts; Filler: 0-70 parts, wherein, the modified polyaryletherketone prepolymer is at least prepolymerized by cage silsesquioxane and polyaryletherketone polymer As a result, compared with the prior art, the high-frequency resin composition in the present invention has high heat and humidity resistance, high glass transition temperature, low dielectric constant and dielectric loss tangent, and can meet high-frequency high-speed and Requirements for high-performance printed circuit boards such as high-density interconnections.

Description

Technical field[0001]The present invention relates to the field of electronic material, and in particular, to a high frequency resin composition and a semi-solid tablet, a laminate, and an interlayer insulating film prepared thereof.Background technique[0002]With communication, electronic products develop in the direction of high frequency, high-speed, users have become higher and higher in performance requirements, and high-frequency high-performance substrate materials have become an important cutting-edge technology for development of printed boards. Many companies join the ranks of new technologies to develop new materials. The conventional resin substrate material is replaced by high frequency, high speed, high reliability substrate material, and the market demand is getting bigger. The performance of the high-frequency microwave circuit board directly determines high-frequency, high speed, and high reliability of high-end electronic information technology.[0003]Currently, in h...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L71/12C08L83/12C08L61/14C08K7/18C08K7/14C08J5/24C08J7/04C08G77/46B32B17/04B32B17/06B32B15/20B32B27/04B32B27/28
Inventor 杨宋李兴敏马建崔春梅陈诚
Owner SHENGYI TECH SUZHOU