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Heat sink

A heat sink and heat dissipation fin technology, which is applied in the direction of electric solid devices, semiconductor devices, semiconductor/solid state device components, etc., can solve the problem of low heat dissipation efficiency of finned heat sinks, and achieve the purpose of increasing the effective contact area and good Heat dissipation performance and the effect of increasing the contact area

Active Publication Date: 2019-05-10
江苏古田自动化股份有限公司
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Problems solved by technology

[0003] In order to overcome the deficiencies of the above-mentioned prior art, the object of the present invention is to provide a heat sink, which solves the technical problem of low heat dissipation efficiency of the finned heat sink, and has the characteristics of simple structure and high heat dissipation efficiency

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Embodiment Construction

[0022] The structural principle and working principle of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0023] see Figure 1-4 , a heat sink, mainly comprising heat dissipation fins-1; slotted regular hexagonal heat conduction columns-2-1; cylindrical heat conduction columns-2-2; substrate-3. It is characterized in that the heat dissipation fin 1 adopts a regular hexagonal honeycomb structure with slots, and is distributed vertically on the substrate in a ring shape; the heat conduction column 2 is composed of several hexagonal columns 2-1 and a cylinder in the middle The columns 2-2 are vertically distributed on the base plate, the hexagonal columns 2-1 are distributed around the periphery of the cylindrical column 2-2, and the cylindrical column 2-2 is distributed in the center of the base plate 3. According to the distribution of heat on the substrate, the heat is reasonably conducted to the air through the ...

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Abstract

A heat sink comprises cooling fins, a heat conduction vertical post and a substrate, wherein the heat conduction vertical post comprises a regular-hexagonal honeycomb with a groove and a cylinder at amiddle part, wherein the cooling fins employ regular-hexagonal honeycomb structures with grooves, and the heat conduction vertical post and the annularly-distributed cooling fins are vertically arranged on the cylinder substrate. Heat conduction between a hot source and the heat sink is accelerated by the heat conduction vertical post, the contact are between a surface of the heat sink and air isexpanded by the cooling fins, and the heat sink has the characteristics of simple structure and high cooling efficiency.

Description

technical field [0001] The invention belongs to the technical field of electrical components, and in particular relates to a radiator. Background technique [0002] High-power equipment is currently developing in the direction of miniaturization and high reliability. As the main heat dissipation device for heat-generating chips in high-power equipment, the radiator's volume, weight, and heat dissipation performance have an important impact on the volume, weight, and life of high-power equipment. As the commonly used radiator structure at present, the finned structure has a high or low heat dissipation efficiency depending on the effective heat dissipation area of ​​a single fin and the size of the spacing between fins. However, when the volume is constant, the large effective heat dissipation area will inevitably lead to The spacing between them is small, so the heat dissipation efficiency is usually not high, resulting in a large radiator volume for high-power devices. C...

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Application Information

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IPC IPC(8): H01L23/367H01L23/467
Inventor 朱凌建赵怀军孙柯欧珍珍党澍萌
Owner 江苏古田自动化股份有限公司