1553 bus interface circuit rapid screening system and method based on self testing

Abstract

A 1553 bus interface circuit rapid screening system and method based on self testing are used for function abnormity screening on a Mini-ACE series after completing MCM packaging, to eliminate a protocol failure circuit and a memory failure circuit. The system comprises primary power supply, secondary power supply, a main control processor, I/O input and output, logic decoding, a VGA controller, aresult prompt and a display. The main control processor inputs screening excitation to the to-be-tested circuit through the HOST interface of the to-be-tested circuit according to a corresponding screening mode, and starts RAM test, stops RAM test, starts a protocol test, and stops a protocol test, and outputs a result to screening personnel through a prompt module and a display according to thescreening condition. The method is used for the production process of the 1553 series interface circuit with the self-test function, the failure circuit can be removed in the early stage, the work ofconventional anti-fuse structure melting and burning, three-temperature test, effectiveness test and the like on the failure circuit in the production process is avoided, the labor hour waste is greatly reduced, and the production efficiency and the productivity are improved.

Description

technical field [0001] The invention relates to a self-test-based 1553 bus interface circuit rapid screening method and a test system, which are suitable for screening 1553 bus interface circuits with a self-test function. Background technique [0002] In the production process of the MINI-ACE series 1553 bus interface circuit, from outsourcing production of wafers, procurement of shells, cover plates, capacitors to scribing, completion of MCM packaging, and then directly into the conventional anti-fuse structure melting , three-temperature test and effectiveness test and other production links, because the latter three production links are complicated, difficult to test, and take a long time, so once the circuit function is abnormal after the MCM packaging is completed, the subsequent huge workload will be Pointless and a waste of human and financial resources. At present, there is no similar test system design scheme on the market, so this screening method and test system...

AI Technical Summary

Problems solved by technology

[0002] In the production process of the MINI-ACE series 1553 bus interface circuit, from outsourcing production of wafers, procurement of shells, cover plates, capacitors to scribing, completion of MCM packaging, and then directly into the conventional anti-fuse structure melting , three-temperature test and e

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