A kind of improved molding method of etpu foam

Abstract

The invention discloses an improved molding method of an ETPU (expanded thermoplastic polyurethane) foaming body. The method comprises following steps: 1, TPU (thermoplastic polyurethane) particles are impregnated in high-pressure fluid, dissolution equilibrium of the high-pressure fluid in the TPU particles is realized, pressure of the high-pressure fluid is 70 MPa or lower, and temperature of the high-pressure fluid is 70 DEG C or lower; 2, the TPU particles reaching the dissolution equilibrium are refrigerated in a refrigeration storage, so that the high-pressure fluid in the TPU particlesis still retained in the TPU particles; 3, a certain quantity of TPU particles reaching the dissolution equilibrium are taken out from the refrigeration storage according to actual demands and subjected to molding in a steam foaming or die pressing foaming mode, and the ETPU foaming body is obtained. The improved molding method has the characteristics of better connectivity of the adjacent particles and low production cost.

Description

technical field [0001] The present invention relates to the field of ETPU foam molding, in particular to a kind of improved molding method of ETPU foam, which has the characteristics of better connection degree of adjacent particles and low production cost. Background technique [0002] At present, the ETPU popcorn foam on the market is basically made by the following two steps. The first step is to make ETPU particles from TPU particles through chemical or supercritical foaming. These are made by one-time foaming. The ETPU particles usually need to be stored in the warehouse; the second step is to put the ETPU particles obtained in the first step into a specific mold. After steam foaming, the adjacent ETPU particles must be fused and cooled. The finished ETPU foams are then obtained, and these ETPU foams are widely used in various fields such as shoe soles, tires, and insoles in the market. [0003] However, in the application of the applicant for many years, the above-men...

AI Technical Summary

Problems solved by technology

[0008] The main purpose of the present invention is to provide a kind of improved molding method of ETPU foam, to solve the relatively poor connection degree of adjacent ETPU particles in the prior art ETPU foam and the higher shortcoming of production cost