Gold bonding wire finished product display cabinet

Abstract

The invention discloses a gold bonding wire finished product display cabinet. The cabinet comprises a cabinet body, rotating devices and a cleaning device, wherein during rotation of a turntable, clamping teeth are formed on the outer radial surface of the turntable and meshed with a pulling block in each placing device, and therefore the pulling blocks can be driven to move; under the action of force, fixing wheels and clamping pieces at the bottoms of connecting plates drive a sliding belt at the bottom to move; the bottom of the sliding belt is slidably connected with a sliding groove through balls, so that gold bonding wires on the tops of the placing devices and placing plates are rotated; an antiskid pad is arranged on the top of each placing plate and can prevent gold bonding wire exhibits from falling off during rotation. The six groups of placing devices are distributed at equal intervals and circularly rotate to achieve a comprehensive display effect. Moreover, a user can place different exhibits according to his / her needs, and the problem that products cannot be continuously and annularly rotated is solved.

Description

technical field [0001] The invention relates to the related field of bonding gold wire, in particular to a display cabinet for bonding gold wire finished products. Background technique [0002] Bonding gold wire is a gold alloy wire used as a connecting wire in integrated circuits, also known as ball bonding gold wire or lead gold wire. The gold content is ≥99.99%, and the sum of trace elements is <0.01%. There are γ-type, C-type and FA type and other three types, the latter two are used for high-speed bonding, and the trace elements are beryllium, copper, silver, etc., which have the functions of refining grains, increasing recrystallization temperature and strengthening gold. Melting and directional crystallization, the ingot is cold-processed after homogenization, or manufactured by a liquid extrusion process, the bonding gold wire is an important material in the microelectronics industry, used as a connecting wire between the chip and the lead frame, after the bonding...

AI Technical Summary

Problems solved by technology

[0002] Bonding gold wire is a gold alloy wire used as a connecting wire in integrated circuits, also known as ball bonding gold wire or lead gold wire. The gold content is ≥99.99%, and the sum of trace elements is <0.01%. There are γ-type, C-type and FA type and other three types, the latter two are used for high-speed bonding, and the trace elements are beryllium, copper, silver, etc., which have the functions of refining grains, increasing recrystallization temperature and strengthening gold. Melting and directional crystallization, the ingot is cold-processed after homogenization, or manufactured by a liquid extrusion process, the bonding gold wire is an important material in the microelectronics industry, used as a connecting wire between the chip and the lead frame, after the bonding gold wire is produced , manufacturers will display to the public through display cabinets, so that the public can better understand their products and achieve a promotional effect. A good display effect can improve the image of their brand among the public or even increase the income in the later stage. The bonded gold wire finished product display cabinet does not have the static and dynamic synchronous display of the same product to better explain the product; the product cannot be continuously rotated; during the display process and after the display is over, there will be some on the surface of the exhibit Dust can easily affect the glossiness of the bonded gold wire and affect the display effect when displaying the finished product

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