Electronic tag chip suitable for flip-chip bonding and passive ultrahigh frequency RFID tag with temperature sensor

Abstract

The invention discloses an electronic tag chip suitable for flip-chip bonding and a passive ultrahigh frequency RFID tag with a temperature sensor. The invention relates to the technical field of integrated circuits, in particular to an electronic tag chip suitable for flip-chip bonding and a passive ultrahigh frequency RFID tag with a temperature sensor. The invention provides an electronic tag chip suitable for flip-chip bonding and a passive ultrahigh frequency RFID tag with a temperature sensor. In the flip-chip bonding process, the stress of the chip can be uniform, and the residual stress is avoided. The pressure welding structure comprises an internal circuit and four pressure welding blocks, and is characterized in that the four pressure welding blocks are uniformly distributed onthe top surface of the chip, and the four pressure welding blocks comprise a process pressure welding block C and a process pressure welding block D, and an effective pressure welding block A and an effective pressure welding block B which are communicated with the internal circuit; And the top surfaces of the effective pressure welding block A and the effective pressure welding block B are exposed out of the top surface of the chip. According to the invention, the yield and the speed of flip-chip bonding are improved, so that the packaging cost is reduced.

Description

technical field [0001] The invention relates to the technical field of integrated circuits, in particular to an electronic label chip suitable for flip-chip welding and a passive ultra-high frequency RFID label with a temperature sensor. Background technique [0002] Passive UHF RFID technology is a new low-power and low-cost short-range wireless communication technology. Such as Figure 8 As shown, the passive UHF RFID system consists of a tag attached to the target object, a reader, a reader antenna and a computer. The "passive" here mainly means that the tag does not contain a battery. Among them, the relevant information of the target object is stored in the tag, and the reader uses electromagnetic waves as the carrier to send energy, instructions and data to the tag. When an object with a tag enters the communication range of the reader, the reader can read the information in the tag in a non-contact manner according to the needs of the application and send it to the c...

AI Technical Summary

Problems solved by technology

like Figure 9 As shown in , the tag chip of the general RF rectifier structure usually has two effective soldering blocks. The chip is unbalanced in the process of flip-chip welding. First, it will cause deformation of the chip or even "break" the chip; second, the residual stress will be caused by the deformation of the chip.

This will reduce the real-time reliability of the connection between the chip and the antenna, resulting in a high defect rate; especially when the ambient temperature changes greatly, the residual stress will reduce the reliability of the connection between the chip and the antenna, resulting in a decline in product quality

Images