Tensile display device and preparation method

A technology for display devices and light-emitting elements, applied in semiconductor/solid-state device manufacturing, electric solid-state devices, semiconductor devices, etc., can solve the problems of flexible substrates and other film layer damage, low production yield of stretched display devices, etc., to achieve Improve production yield, facilitate removal, and relieve film damage

Active Publication Date: 2019-05-21
BOE TECH GRP CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] Currently, stretched display devices suffer from low production yields
After in-depth research and a large number of experiments, the inventor found that this is mainly d

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  • Tensile display device and preparation method
  • Tensile display device and preparation method
  • Tensile display device and preparation method

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Embodiment Construction

[0029] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

[0030] In one aspect of the invention, the invention proposes a method for preparing a stretched display device. As mentioned above, in the prior art, the stretched display device needs to be prepared on a rigid substrate, and after the preparation is completed, the flexible display device is peeled off from the rigid substrate (glass substrate). Specifically, refer to figure 2 , after the stretched display device is prepared on the substrate 100, the substrate 100 and the flexible substrate 200 need to be peeled off, because the encap...

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Abstract

The invention discloses a tensile display device and a preparation method. The method comprises the steps of providing a base board, and arranging a flexible substrate on the base board; arranging a film layer used for forming a thin film transistor on one side, far away from the base board, of the flexible substrate, and defining a plurality of pixel areas on one side, far away from the flexiblesubstrate, of the film layer; forming a hollow part between the every two adjacent pixel areas, wherein the hollow parts run through the film layer and the flexible substrate; arranging thermal separation gel in the hollow parts; arranging light-emitting elements in the pixel areas, and arranging packaging film layers on one sides, away from the flexible substrate, of the light-emitting elements and the thermal separation gel; and heating the thermal separation gel, and stripping the flexible substrate and the base board. When the base board is stripped by using the method, the problem that the flexible substrate and the film layer used for forming the thin film transistor are damaged can be relieved, so that the production yield of the tensile display device is remarkably improved.

Description

technical field [0001] The invention relates to the field of display technology, in particular, to a stretched display device and a preparation method. Background technique [0002] With the continuous development of display technology, people pay more and more attention to stretched display devices. In addition to being able to withstand bending, folding, and rolling, stretchable display devices can also withstand pressure and stretching, and have extremely high application prospects in wearable displays, skin displays, Internet of Things devices, automobiles, and artificial intelligence. [0003] However, the current stretched display devices and preparation methods still need to be improved. Contents of the invention [0004] The present invention is based on the inventor's discovery and recognition of the following facts and problems: [0005] Currently, stretched display devices suffer from a low production yield. After in-depth research and a large number of exper...

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Application Information

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IPC IPC(8): H01L27/32H01L51/52
CPCY02E10/549H10K59/00H10K71/80H10K77/111H10K2102/311H10K50/844H10K59/122H10K71/40H10K59/124H10K2102/351
Inventor 李晓虎薛金祥焦志强
Owner BOE TECH GRP CO LTD
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